Fast Cure Flexible Silicone Potting Compound 1:1 Thermally Conductive Flame Retardant for Electronic Components

Fast Cure Flexible Silicone Potting Compound for Electronic Components

HN-8806 is a two-component 1:1 addition-cure silicone potting rubber that cures into a flexible, high-performance elastomer at room temperature or with heating. Offering fast heat cure, thermal conductivity, flame retardancy and OEM color customization, it is widely used for potting and protecting electronic components, circuit boards and connectors.

Key Features

• Fast Cure: Initial cure in 4-12 hours at 25°C or only 12 minutes at 80°C, accelerating production cycles on potting lines.
• Flexible Elastomer: Cured rubber stays flexible, absorbing thermal expansion and mechanical stress of electronic components.
• Thermally Conductive: 0.8 W/m·K thermal conductivity (≥0.76 W/m·K tested) for heat dissipation of power components.
• Flame Retardant: Self-extinguishing grade with high and low temperature resistance from -50°C to 250°C.
• Component Safe: Low shrinkage rate, releases no heat or by-products and does not corrode potted components after curing.
• Excellent Electrical Properties: Dielectric strength 18-25 kV/mm and volume resistivity 1.0*10^16 Ω·cm.
• OEM Customization: Color (white, grey, black), hardness, viscosity and packaging can be customized; free samples available.
• Easy 1:1 Mixing: Equal-weight ratio and 4500-5000 mPa·s mixed viscosity suit manual and automated metering potting equipment.

Typical Physical Properties

• Mix Ratio: A:B = 1:1 by weight
• Appearance: Grey and white fluid before curing
• Viscosity (25°C): 4500-5000 mPa·s (mixed)
• Density: 1.50 ± 0.05 g/cm³
• Operating Time (25°C): 18-24 minutes
• Curing Condition: 4-12 hours at 25°C (initial cure) or 12 minutes at 80°C
• Hardness: 50 ± 5 Shore A
• Thermal Conductivity: ≥0.76 W/m·K
• Dielectric Strength: 18-25 kV/mm
• Volume Resistivity: 1.0*10^16 Ω·cm
• Temperature Range: -50°C to 250°C
• Shelf Life: 6 months

Applications

• Electronic components and PCB potting
• Connectors and sensors encapsulation
• Power supply and LED module potting
• Automotive electronic components

Packaging & Supply

Available in 10 kg/set or 25 kg/iron drum A+B packing with MSDS and TDS documentation. Free samples offered. ODM and OEM customization welcome. Contact our technical team for details.