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Flame Retardant Thermally Conductive Epoxy Potting Compound 1.0 W/mK for Marine Lithium Battery Packs

Flame Retardant Thermally Conductive Epoxy Potting Compound 1.0 W/mK for Marine Lithium Battery Packs

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: HANAST
Certification: GB/T 38712-2020
Model Number: HN-9626A/B
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
HANAST
Certification:
GB/T 38712-2020
Model Number:
HN-9626A/B
Product Type:
Two-Component Flame Retardant Thermally Conductive Epoxy Potting Compound
Application:
Marine Lithium Battery Pack Encapsulation
Mix Ratio (A:B):
13:1 By Weight
Component A Appearance:
Black Viscous Liquid
Component B Appearance:
Colourless To Pale-Yellow Transparent Liquid
Component A Viscosity (25 C):
35000-43000 MPa.s
Mixed Viscosity (25 C):
3000-5000 MPa.s
Pot Life (25 C):
90-100 Minutes
Density (Component A, 25 C):
1.80-2.00 G/cm3
Thermal Conductivity:
0.9-1.3 (typ. 1.0) W/m.K
Hardness:
Shore D 85 +/- 3
Dielectric Strength:
> 25 KV/mm
Surface Resistivity:
> 1.2 X 10^14 Ohm
Dielectric Constant (50 Hz):
4.80-5.30
Tensile Strength:
65-75 MPa
Flexural Strength:
95-110 MPa
Glass Transition Temperature (Tg):
120 +/- 5 C
Operating Temperature Range:
-40 C To +180 C
Cure Condition:
Room Temperature, Full Cure >= 72 H At 25 C
Flame Retardancy:
Flame Retardant
Packaging:
25 Kg/barrel
Highlight:

High Light

Highlight:

Two-Component Room-Temperature Cure Epoxy

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Flame Retardant Thermally Conductive Compound

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Marine Lithium Battery Pack Potting

Trading Information
Minimum Order Quantity:
1 kg
Packaging Details:
25 kg/barrel
Delivery Time:
3-7 working days for stock, 15-25 days for production
Payment Terms:
T/T,PayPal
Supply Ability:
50000 kg per Month
Product Description

Flame Retardant Thermally Conductive Epoxy Potting Compound for Marine Lithium Battery Packs

A high-performance, two-component epoxy potting and encapsulation compound engineered for the thermal management and mechanical protection of marine lithium battery packs and other demanding electronic assemblies. Thermal conductivity 1.0 W/mK.

Product Overview

This two-component flame-retardant and thermally conductive epoxy potting compound forms a rigid, high-strength encapsulant after mixing and curing at room temperature. Component A is a black viscous liquid and Component B is a colourless to pale-yellow transparent liquid. At a 13:1 mix ratio by weight, the compound cures into a durable encapsulant that combines excellent mechanical strength, outstanding electrical insulation, flame retardancy and thermal conductivity. It is designed for the potting protection of battery packs, power modules and circuit boards that require heat dissipation, flame retardancy and high mechanical strength.

Key Features

  • Flame retardant and thermally conductive formulation for heat-dissipating electronic encapsulation
  • Thermal conductivity 1.0 W/mK for effective heat dissipation
  • High mechanical strength: tensile 65-75 MPa, flexural 95-110 MPa
  • High glass transition temperature: Tg 120 ± 5 °C
  • Excellent electrical insulation: surface resistivity > 1.2 × 1014 Ω, dielectric strength > 25 kV/mm
  • Wide operating temperature range: -40 °C to +180 °C
  • Room-temperature curing; no heating required
  • Long pot life: 90-100 minutes at 25 °C for a comfortable working time
  • Good fluidity after mixing (3000-5000 mPa·s) for easy potting and self-levelling

Flame retardant thermally conductive epoxy potting compound features

Typical Applications

  • Thermal management and potting protection of marine lithium battery packs
  • Encapsulation of battery management systems (BMS), power modules and circuit boards
  • Flame-retardant potting of power supplies, inverters and industrial electronics
  • High-strength encapsulation of components subject to mechanical stress or vibration in marine environments

Thermally conductive epoxy potting compound applications

Technical Data - After Mixing (A+B)

PropertyUnitValue
Appearance-Black liquid
Mixed Viscosity (25 °C)mPa·s3000-5000
Pot Life / Operating Time (25 °C)min90-100
Mix Ratio (A:B)by weight13:1

Technical Data - Cured Properties

PropertyUnitValue
Surface Resistivity (25 °C)Ω> 1.2 × 1014
HardnessShore D85 ± 3
Thermal ConductivityW/m·K0.9-1.3 ± 0.1 (typ. 1.0)
Dielectric Strength (25 °C)kV/mm> 25
Tensile StrengthMPa65-75
Flexural StrengthMPa95-110
Glass Transition Temperature (Tg)°C120 ± 5
Operating Temperature Range°C-40 to +180

Thermally conductive epoxy potting compound technical data

Mixing & Application Instructions

  1. Pre-mix: Stir Component A thoroughly before use to ensure any settled thermally conductive filler is uniformly dispersed.
  2. Weighing: Accurately weigh Components A and B per the 13:1 ratio by weight using a high-precision electronic scale.
  3. Mixing: Mix A and B thoroughly until uniform in colour, ensuring resin on the container walls and bottom is fully dispersed.
  4. Degassing: For bubble-free potting, degas under vacuum to remove entrapped air.
  5. Potting: Pour the mixed compound into the clean, dry device within the 90-100 minute pot life, ensuring full coverage.
  6. Curing: Allow to cure at room temperature. Full mechanical and electrical properties develop after ≥ 72 hours at 25 °C. For large-volume pours, monitor exotherm and consider layered pouring.

Packaging

ComponentPackage SizeContainer Type
Component A19.5 kgIron drum / plastic drum
Component B1.5 kgPlastic drum / bottle
Kit (A+B)21 kg/set-

Storage & Shelf Life

  • Store in original, tightly sealed containers in a cool, dry, well-ventilated area below 25 °C.
  • Protect from direct sunlight, moisture, heat and extreme temperatures.
  • Component B is sensitive to moisture; reseal immediately after use.
  • Store Components A and B separately and away from water-based products.
  • Transportation: classified as non-dangerous goods (general chemicals).