2.0 W/mK Thermal Conductivity Silicone Potting Compound UL 94 V-0 Flame Retardant 1:1 Mix Ratio Thermally Conductive Encapsulant

Hanast HN-8820A/B High Thermal Conductivity Addition-Cure Silicone Potting Compound

Hanast HN-8820A/B is a two-component platinum-catalyst addition-cure silicone potting compound engineered for high-power-density electronics where heat dissipation is mission-critical. Delivering an exceptional thermal conductivity of 2.0 ± 0.1 W/m·K — nearly three times that of standard compounds — HN-8820 dramatically reduces junction temperatures on power semiconductors, enabling smaller heatsink footprints and longer device lifespans.

Why HN-8820 Outperforms Standard Compounds

Complete Technical Data Sheet (HN-8820A/B)

B2B Application Scenarios (Expanded Coverage)

• EVElectric Vehicle Motor Controllers — IGBT/SiC module potting with 2.0 W/m·K channel dissipating switching losses directly through housing walls
• Industrial Drive Inverters — Motor drive power module encapsulation for CNC machines, pumps, and compressors under continuous duty
• LED High-Power Driver Modules — COB LED and street-lighting driver board potting achieving IP67 waterproof rating with thermal path to aluminum enclosure
• Automotive HID & Laser Headlamp Drivers — Automotive-grade insulation and thermal management for 150W+ headlamp ballasts
• Wireless Charging Coil Assemblies — Resonant coil potting protecting copper windings while providing heat path from eddy-current losses
• Power Supply Transformer Laminations — Transformer potting preventing coil movement-induced hum and conducting core heat away
• Railway Traction Converter Modules — Railway-certified environmental sealing for traction inverter power stages under heavy vibration
• Solid-State Relay Modules — SSR encapsulation isolating control side from power side with reliable creepage paths
• UPS Battery Management Boards — UPS battery BMS circuit protection against humidity, dust, and thermal runaway propagation
• Fuel Cell Stack Interconnect Boards — Proton-exchange membrane fuel-cell stack interconnect potting for hydrogen vehicle power-trains
• Telecom Power Rectifier Modules — Rectifier board potting in 48V telecom power supplies ensuring 20-year outdoor cabinet operation
• Solar Micro-Inverter Power Boards — String-inverter bypass diode and micro-inverter capacitor bank encapsulation

Thermal Performance: HN-8820 vs Market Alternatives

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly before use (fillers may settle); shake Component B well to homogenize.
2. Weigh: Accurately measure A:B at 1:1 ratio by weight using precision scale. Keep containers sealed when not in use.
3. Mix: Blend in one direction until uniform color. Scrape walls and bottom for complete dispersion. Avoid excessive air incorporation.
4. Degas (Optional): Vacuum degas for void-sensitive applications such as fine-pitch BGA packages.
5. Pour: Dispense mixed compound into clean, dry device within pot life (1–2 h at 25°C). Ensure full coverage.
6. Cure: Room temperature 2–4 h for full cure. Heat-accelerated cure at 80°C for 10–20 min for fast production cycling.

About This Supplier

Shenzhen Hanast New Materials Co., Ltd. is a professional manufacturer of liquid silicone rubber specialising in addition-cure (platinum) and condensation-cure silicone for mould making. Our HN-E6XX platinum series covers 0–60 Shore A and is certified to FDA, MSDS, RoHS and REACH, serving customers in jewellery, arts & crafts, construction, food-contact and precision casting industries worldwide.

Frequently Asked Questions

Q1: How does 2.0 W/m·K thermal conductivity compare to standard RTV-2 compounds?

A1: Most standard RTV-2 compounds deliver 0.5–0.76 W/m·K. HN-8820's 2.0 W/m·K is approximately 3* higher, enabling substantially smaller heatsinks and 15–20% lower junction temperatures under identical thermal loads — translating to significantly improved device MTBF via the Arrhenius reliability model.

Q2: Is the 1:1 weight-ratio mixing suitable for fully automated dispensing?

A2: Yes. The 1:1 weight ratio is ideal for calibrated dual-pump dispensing systems. Our technical team provides pump-parameter calibration support and static-mixer selection guidance to achieve consistent 1:1 delivery with less than ±2% deviation across production runs.

Q3: What is the maximum voltage isolation provided by this compound?

A3: With volumetric resistivity ≥5.0*10¹⁴ Ω·cm and dielectric strength meeting industry standards, HN-8820 provides robust insulation for applications up to several kilovolts. Specific breakdown voltage depends on cured layer thickness and test conditions.

Q4: Can HN-8820 be used on large PCBAs without partial-filling issues?

A4: Yes. Its generous 1–2 hour pot life at 25°C gives operators ample time to dispense and level the compound across medium-to-large boards without edge-curing before pour completion.

Q5: Does the higher filler content (density 2.0 g/cm³) affect pouring flow?

A5: Despite higher mineral filler loading required for 2.0 W/m·K thermal conductivity, HN-8820 maintains a manageable viscosity of 5000–8000 mPa·s — low enough for gravity-fed pouring and self-leveling on horizontal surfaces without specialized dispensing equipment.