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Company Cases about Does the volume of two-component potting adhesive expand after 1:1 curing

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Does the volume of two-component potting adhesive expand after 1:1 curing

2025-03-26

The phenomenon of incomplete curing or inability to cure when added silicone gel comes into contact with ionic compounds containing N, P, S organic compounds, Sn, Pb, Hg, As, and other elements, as well as alkynes and multi-vinyl compounds, is called "poisoning". The solder joints and residual rosin on the circuit board all contain the above-mentioned compound components. When using the circuit board, it is advisable to clean the residual rosin as much as possible, use low lead solder as much as possible, and cure it by heating.
Common materials and objects that are prone to poisoning include lead-containing solder, flux, hot melt adhesive, condensed silicone (including single and two-component condensed silicone), vulcanized rubber, etc.

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