2025-09-11
Application Scenario: UAV flight controllers and image transmission modules.
Challenges: Intense vibrations during flight, low temperatures at high altitudes, and potential collisions pose a threat to the stability of core electronic components.
Solution: Modules are potted using lightweight, low-density, and flexible silicone gel.
Value: This provides all-round, cushion-like protection for precision sensors and BGA chips, resisting vibration and collision. Its lightweight design minimizes flight burden, ensuring flight safety and stable image transmission.