Challenges: Intense vibrations during flight, low temperatures at high altitudes, and potential collisions pose a threat to the stability of core electronic components.

Solution: Modules are potted using lightweight, low-density, and flexible silicone gel.

Value: This provides all-round, cushion-like protection for precision sensors and BGA chips, resisting vibration and collision. Its lightweight design minimizes flight burden, ensuring flight safety and stable image transmission.

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The Largest R&D and Production Tin Cure Silicone Rubber Supplier in China

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