Challenges: Intense vibrations during flight, low temperatures at high altitudes, and potential collisions pose a threat to the stability of core electronic components.

Solution: Modules are potted using lightweight, low-density, and flexible silicone gel.

Value: This provides all-round, cushion-like protection for precision sensors and BGA chips, resisting vibration and collision. Its lightweight design minimizes flight burden, ensuring flight safety and stable image transmission.

최신 회사 사례 [#aname#]

부지 1210-1211, 블록 B, 빌딩 6, 헨다 패션밸리, 달랑 거리, 롱후아 지구,?? 진, 광둥 성, 중국 E-mail: sales11@hanastsilicone.com Tel: +8613670122311 Tel: +8613670122311

가장 큰 연구 개발 및 생산 Silicone Potting Compound 중국 공급업체

8613670122311

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