Challenges: Intense vibrations during flight, low temperatures at high altitudes, and potential collisions pose a threat to the stability of core electronic components.

Solution: Modules are potted using lightweight, low-density, and flexible silicone gel.

Value: This provides all-round, cushion-like protection for precision sensors and BGA chips, resisting vibration and collision. Its lightweight design minimizes flight burden, ensuring flight safety and stable image transmission.

latest company case about UAV flight control and image transmission module

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