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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Name: 25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8808
Availability: InStock

제품 세부 사항:

원래 장소:	중국 광동
브랜드 이름:	Hanast
인증:	ROHS
모델 번호:	HN-8808

자세한 정보

원래 장소:

중국 광동

브랜드 이름:

Hanast

인증:

ROHS

모델 번호:

HN-8808

강조하다:

High Light

강조하다:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

거래 정보

최소 주문 수량:

1kg

가격:

USD

포장 세부 사항:

25 킬로그램 /는 질주합니다

배달 시간:

5~8일

지불 조건:

D/P (지급도 조건), 인수 인도, 전신환

제품 설명

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 0

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 1

Technical Parameters

№	Itrems	Technique Request
1	Appearance	Transparent, White, Black Flowing Liquid
2	Viscosity (before curing) (mPa.S)	A:2000 B:50
3	Specific Gravity (23℃)	0.98
4	Available Time (h, 25℃)	1-2h
5	Entirely Cure Time (h, 25℃)	8-12h
6	Shaw Hardness (JIS A)	25A
7	Volume Resistivity (Ω cm)	≥1×1014
8	Strength of Breakdown Voltage (kv / mm)	18-25
9	Dielectric Constant (1MHZ)	2.5 - 3.0
10	Dielectric Loss Angle Tangent (1MHZ)	≤4×10-3
11	Thermal Conductivity (w / m.k)	0.1 - 0.20

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 2

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 3

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 4

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 5

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 6

태그:

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

High Light

강조하다:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

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