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Compound di silicone per la preparazione del vaso

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Name: 25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8808
Availability: InStock

Dettagli del prodotto:

Luogo di origine:	GUANGDONG, CINA
Marca:	Hanast
Certificazione:	ROHS
Numero di modello:	HN-8808

Informazioni dettagliate

Luogo di origine:

GUANGDONG, CINA

Marca:

Hanast

Certificazione:

ROHS

Numero di modello:

HN-8808

Evidenziare:

High Light

Evidenziare:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

Informazioni di trading

Quantità di ordine minimo:

1 kg

Prezzo:

USD

Imballaggi particolari:

25kg/barile

Tempi di consegna:

5-8 giorni

Termini di pagamento:

D/P, D/A, T/T

Descrizione del prodotto

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 0

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 1

Technical Parameters

№	Itrems	Technique Request
1	Appearance	Transparent, White, Black Flowing Liquid
2	Viscosity (before curing) (mPa.S)	A:2000 B:50
3	Specific Gravity (23℃)	0.98
4	Available Time (h, 25℃)	1-2h
5	Entirely Cure Time (h, 25℃)	8-12h
6	Shaw Hardness (JIS A)	25A
7	Volume Resistivity (Ω cm)	≥1×1014
8	Strength of Breakdown Voltage (kv / mm)	18-25
9	Dielectric Constant (1MHZ)	2.5 - 3.0
10	Dielectric Loss Angle Tangent (1MHZ)	≤4×10-3
11	Thermal Conductivity (w / m.k)	0.1 - 0.20

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 2

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 3

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 4

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 5

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 6

Tag:

Composto per resinatura siliconica da 55 Shore A per colla adesiva per componenti elettronici 1:1, resinatura conduttiva di calore in 2 parti

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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

High Light

Evidenziare:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

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