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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product Details:
Place of Origin: Guangdong,China
Brand Name: Hanast
Certification: ROHS
Model Number: HN-8808
Detail Information
Place of Origin:
Guangdong,China
Brand Name:
Hanast
Certification:
ROHS
Model Number:
HN-8808
Highlight:

High Light

Highlight:

25A Low Viscosity Potting Silicone

,

Electrical Module AB Potting Glue

,

Electronic Component Encapsulation Glue

Trading Information
Minimum Order Quantity:
1kg
Price:
USD
Packaging Details:
25kg/barrel
Delivery Time:
5-8 days
Payment Terms:
D/P, D/A, T/T
Product Description

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

 

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

Technical Parameters

№
Itrems
Technique Request
1
Appearance
Transparent, White, Black
Flowing Liquid
2
Viscosity (before curing) (mPa.S)
A:2000 B:50
3
Specific Gravity (23℃)
0.98
4
Available Time (h, 25℃)
1-2h
5
Entirely Cure Time (h, 25℃)
8-12h
6
Shaw Hardness (JIS A)
25A
7
Volume Resistivity (Ω cm)
≥1×1014
8
Strength of Breakdown Voltage (kv / mm)
18-25
9
Dielectric Constant (1MHZ)
2.5 - 3.0
10
Dielectric Loss Angle Tangent (1MHZ)
≤4×10-3
11
Thermal Conductivity (w / m.k)
0.1 - 0.20

 

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

J
J*e
Japan Jul 20.2026
Price and quality are our top priorities—I've been in this trade for years, and they truly stand out.
J
J*e
Japan Jul 20.2026
Price and quality are our top priorities—I've been in this trade for years, and they truly stand out.