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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

製品の詳細:
起源の場所: 中国広東省
ブランド名: Hanast
証明: ROHS
モデル番号: HN-8808
詳細情報
起源の場所:
中国広東省
ブランド名:
Hanast
証明:
ROHS
モデル番号:
HN-8808
ハイライト:

High Light

ハイライト:

25A silicone potting compound

,

low viscosity AB potting glue

,

electronic components potting silicone

取引情報
最小注文数量:
1kg
価格:
USD
パッケージの詳細:
25kg/バレル
受渡し時間:
5~8日
支払条件:
D/P、D/A、T/T
製品説明

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

 

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 0

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 1

Technical Parameters

Itrems
Technique Request
1
Appearance
Transparent, White, Black
Flowing Liquid
2
Viscosity (before curing) (mPa.S)
A:2000 B:50
3
Specific Gravity (23℃)
0.98
4
Available Time (h, 25℃)
1-2h
5
Entirely Cure Time (h, 25℃)
8-12h
6
Shaw Hardness (JIS A)
25A
7
Volume Resistivity (Ω cm)
≥1×1014
8
Strength of Breakdown Voltage (kv / mm)
18-25
9
Dielectric Constant (1MHZ)
2.5 - 3.0
10
Dielectric Loss Angle Tangent (1MHZ)
≤4×10-3
11
Thermal Conductivity (w / m.k)
0.1 - 0.20

 

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 2

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 3

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 4

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 5

25A Silicone Potting Compound For Electronic Components Electrical Module  Low Viscosity AB Potting Glue 6