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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Name: 25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8808
Availability: InStock

Ürün detayları:

Menşe yeri:	GUANGDONG, ÇİN
Marka adı:	Hanast
Sertifika:	ROHS
Model numarası:	HN-8808

Ayrıntılı Bilgiler

Menşe yeri:

GUANGDONG, ÇİN

Marka adı:

Hanast

Sertifika:

ROHS

Model numarası:

HN-8808

Vurgulamak:

High Light

Vurgulamak:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

Ticaret Bilgisi

Min sipariş miktarı:

1 kg

Fiyat:

USD

Ambalaj bilgileri:

25kg/varil

Teslim süresi:

5-8 gün

Ödeme koşulları:

D/P, D/A, T/T

Ürün Tanımı

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 0

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 1

Technical Parameters

№	Itrems	Technique Request
1	Appearance	Transparent, White, Black Flowing Liquid
2	Viscosity (before curing) (mPa.S)	A:2000 B:50
3	Specific Gravity (23℃)	0.98
4	Available Time (h, 25℃)	1-2h
5	Entirely Cure Time (h, 25℃)	8-12h
6	Shaw Hardness (JIS A)	25A
7	Volume Resistivity (Ω cm)	≥1×1014
8	Strength of Breakdown Voltage (kv / mm)	18-25
9	Dielectric Constant (1MHZ)	2.5 - 3.0
10	Dielectric Loss Angle Tangent (1MHZ)	≤4×10-3
11	Thermal Conductivity (w / m.k)	0.1 - 0.20

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 2

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 3

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 4

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 5

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 6

Etiketler:

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

High Light

Vurgulamak:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

Silikon kaplama jeli,

Çöpten yapılmış bir karışım,

rtv kaplama

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