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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Name: 25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8808
Availability: InStock

Detalhes do produto:

Lugar de origem:	GUANGDONG, CHINA
Marca:	Hanast
Certificação:	ROHS
Número do modelo:	HN-8808

Informações pormenorizadas

Lugar de origem:

GUANGDONG, CHINA

Marca:

Hanast

Certificação:

ROHS

Número do modelo:

HN-8808

Destacar:

High Light

Destacar:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

Informações de negociação

Quantidade de ordem mínima:

1kg

Preço:

USD

Detalhes da embalagem:

25 kg/barril

Tempo de entrega:

5-8 dias

Termos de pagamento:

D/P, D/A, T/T

Descrição do produto

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

Product description:

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

Two-component, it cures on its own after being mixed at room temperature.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 0

Product application:

10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 1

Technical Parameters

№	Itrems	Technique Request
1	Appearance	Transparent, White, Black Flowing Liquid
2	Viscosity (before curing) (mPa.S)	A:2000 B:50
3	Specific Gravity (23℃)	0.98
4	Available Time (h, 25℃)	1-2h
5	Entirely Cure Time (h, 25℃)	8-12h
6	Shaw Hardness (JIS A)	25A
7	Volume Resistivity (Ω cm)	≥1×1014
8	Strength of Breakdown Voltage (kv / mm)	18-25
9	Dielectric Constant (1MHZ)	2.5 - 3.0
10	Dielectric Loss Angle Tangent (1MHZ)	≤4×10-3
11	Thermal Conductivity (w / m.k)	0.1 - 0.20

How to use:

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 2

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 3

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 4

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 5

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue 6

Tags:

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Flexível Silicone Electronic Potting Gel Material For Electronic Components

Obtenha o melhor preço

25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue

High Light

Destacar:

25A silicone potting compound

low viscosity AB potting glue

electronic components potting silicone

gel de encapsulamento de silicone,

composto de encapsulamento de borracha,

encapsulamento RTV

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Flexível Silicone Electronic Potting Gel Material For Electronic Components