Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable
Product descriptions:
HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product
Product features:
Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation
|
Before curing
|
builder
|
Epoxy resin 5508
|
Curing agent 5508
|
|
pigment
|
Black / White et al
|
Ruburn / transparent surface
|
| |
A sticky epoxy resin water
|
r liquid specific
|
|
c gravity, g / cm3
|
1.4-1.5
|
1.05
|
|
Viscosity of 25℃
|
4,500—6,000cp s
|
150—250cp storage
|
|
e Period (25℃)
|
Six months
|
x months
|
|
processabili
|
mixing ratio
|
A: B =5:1 (weight ratio)
|
|
Available for a time of 25℃
|
2-3H (100g mix)
|
|
curing time
|
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
|
|
After curing
|
2 Tensile strength of kg/cm
|
16-18
|
|
2 Compressive strength of kg/cm
|
18-22
|
|
Resistance to the voltage of kv/mm
|
20-22
|
|
Surface resistance ofΩ-cm
|
14
1.2*10
|
|
Volume resistance ofΩ-cm
|
15
1.1*10
|
|
contraction percentage%
|
0.35-0.55
|
|
Water absorption rate was 25℃ * 24H
|
<0.03%
|
|
The hardness of SHORE A
|
85-95
|
|
distortion
temperature ℃
|
130-150
|
|
low temperature resistant ℃
|
-30
|
Application:
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers
Your message must be between 20-3,000 characters!
