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Epoxy Potting Compound

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

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Thermally Conductive Potting Compound

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25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.2
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Certification:

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Supply Ability:

1000000KG

Highlight:

25kg thermally conductive potting epoxy

thermally conductive potting epoxy compound

25kg potting compound for electronic components

Product Description

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Product Overview
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 0

Product Features
Low viscosity: easy to penetrate into the gap of the product to ensure complete potting.

High hardness: the surface is smooth after curing, with high hardness, providing excellent mechanical protection.

Chemical resistance: acid and alkali resistance, moisture resistance, aging resistance, suitable for harsh environments.

Excellent electrical properties: high insulation, pressure resistance and bonding strength.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 1

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 2

Application areas
Electronic appliances: transformers, resistors, filters, temperature sensors, etc.

Industrial equipment: high voltage packaging, aquarium equipment, ultrasonic atomizers, etc.

Others: components that require insulation, flame retardancy and temperature resistance.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 3

Usage
Mix in a weight ratio of A:B = 5:1.

Operation time at 25℃ is 2-3 hours, surface curing in 6-8 hours, and full curing in 12-16 hours; or curing in 1.5-2 hours at 60-80℃.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 4

Packing specifications
30 KG/group (A component 25 KG/barrel, B component 5 KG/can)

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components 5

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Products Details

Home > Products >

Epoxy Potting Compound

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

All Category

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Degumming Agent

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.2
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Brand Name:

Hanast

Certification:

MSDS

Model Number:

HN-5508AB

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Minimum Order Quantity:

1KG

Price:

6.2

Packaging Details:

Plastic/Iron Drums

Delivery Time:

3-5 work days

Payment Terms:

T/T

Supply Ability:

1000000KG

Highlight:

25kg thermally conductive potting epoxy

thermally conductive potting epoxy compound

25kg potting compound for electronic components

Product Description

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30