Batch Stable Silicone Potting Compound For Mass Production Of Electronic Equipment
Product Overview for Silicone Potting Compound:
HN-8808 series potting compounds satisfy rigorous reliability standards for automotive electronics. Featuring superior elastic performance, they efficiently buffer mechanical vibration and impact loads. With a broad service temperature window ranging from -50°C to 200°C, the material maintains consistent performance under harsh under-hood conditions. Formulated to shield automotive electronic modules against moisture, chemical corrosion, thermal cycling and continuous vibration, this compound enables assemblies to pass full automotive-grade reliability validation tests.
Key Performance Parameters for Silicone Potting Compound:
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Appearance (Mixed)
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Transparent/Black/White Elastomer (select as needed)
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Mix Ratio (A:B)
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10 : 1 (by weight)
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Pot Life (25°C)
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40-60 minutes
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Cure Time (25°C)
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4-6 hours (tack-free), 24 hours (full cure)
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Hardness (Shore A)
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30-40 (GB/T531-1999)
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Volume Resistivity
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≥5.0×10¹⁴ Ω·cm (GB/T 31838.2-2019)
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Thermal Conductivity
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0.3-0.5 W/M·K (depending on color, GB/T 38712-2020)
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Dielectric Strength
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≥14 kV/mm
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Product Highlightsfor Silicone Potting Compound:
* Exceptional Environmental Resilience: Resistant to thermal shock, high temperature/humidity, with stable performance under extremes.
* Excellent Chemical Resistance: Good resistance to automotive oils, brake fluids, coolants, etc.
* Effective Stress Relief: Low hardness and high elasticity absorb stress between PCB and housing, protecting delicate components.
* Long-Term Durability: Superior anti-aging properties ensure continuous protection throughout the vehicle's lifecycle.
* Compliant with Environmental Standards: Products comply with directives like RoHS, meeting automotive industry environmental requirements.
Application Areas for Silicone Potting Compound:
* Engine Control Units (ECU)
* Battery Management Systems (BMS), Onboard Chargers (OBC)
* Sensors (e.g., pressure, position sensors)
* Light controllers, wiper controllers
* Infotainment systems & dashboards
Detailed Operating Guide for Silicone Potting Compound:
1. Pre-Production Process Verification
Full process verification prior to mass manufacturing is highly advised to verify compatibility with base materials including epoxy PCBs and polyurethane enameled wires.
2. Accurate Metering & Homogeneous Mixing
Dual-fluid dispensing machines paired with static mixing nozzles are recommended. Precise proportioning and complete blending are essential to guarantee long-term automotive-grade reliability.
3. Mandatory Vacuum Defoaming
Vacuum degassing must be carried out to avoid partial discharge risks and elevated thermal resistance caused by trapped air bubbles.
4. Clean & Climate-Controlled Potting Workshop
Carry out potting operations within a dust-free space with stable temperature and humidity to reduce contamination of electronic components.
5. Standard Curing & Full Post-Curing Cycle
Wait a minimum of 24 hours at room temperature post potting before conducting electrical performance tests. Complete assembly sealing and strict environmental reliability tests after full 7-day curing.
Packaging & Storage for Silicone Potting Compound:
Two standard package sizes are offered
11kg complete set (10kg Component A + 1kg Component B)
22kg complete set (20kg Component A + 2kg Component B).
200kg steel drums are optional for large-scale mass production.
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