Hard Acid Alkali Resistant Epoxy Potting Compound Moisture Proof Anti-Disassembly For Transformer Mass Production
Description of Epoxy Potting Compound
5:1 Black Epoxy Potting Compound is a two-part black epoxy encapsulant. It consists of resin (Part A) and curing agent (Part B) with a standard weight mixing ratio of 5:1, and can be fully cured either at ambient temperature or with heating.
technical parameter of epoxy potting compound:
| Name | epoxy potting compound |
| Mix ratio | 5:1 |
| Color | Black |
| Feature | High hardness |
| MOQ | 1KG,6KG |
| Application | Transformers and coils, power supplies and modules, etc. |
| Hardness | 85-95 shore D |
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
Application of epoxy resin potting:
1. Power supply units & power modules
2. Automotive electronics and industrial electronic assemblies
3. Encapsulation protection for electronic components & circuit boards
4. Special-environment applications: aquarium pumps, LED modules, lighting fixtures and more
Purchasing Guide and Important Considerations of epoxy potting compound:
1. Mixing Ratio Reminder
The 5:1 proportion is calculated by weight instead of volume. An electronic weighing scale is required for accurate dosing. Incorrect proportions will lead to incomplete curing and substandard finished performance.
2. Limited Pot Life
Chemical reaction initiates right after Part A and Part B are blended. At 25°C ambient temperature, the usable pot life lasts about 30–40 minutes. All pouring and encapsulation work must be finished within this window.
3. Curing Cycle Instructions
Full room-temperature curing at 25°C takes 24 hours. For faster production, thermal curing at 60°C for 2–3 hours is available. Heat curing also delivers better comprehensive mechanical and electrical properties of the epoxy.
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