HN-8808 White Silicone Potting Compound For LED Light Strip Encapsulation
Product Overview for Silicone Potting Compound:
HN-8808B Black Potting Compound is developed for electronic devices with high heat density. Featuring thermal conductivity of 0.5 W/m·K, it efficiently dissipates heat from hot spots and reduces the operating temperature of core components. Its black filler delivers certain EMI shielding performance, realizing integrated thermal management and EMC optimization to prolong service life of electronic equipment.
Key Performance Parameters for Silicone Potting Compound:
| Appearance (Mixed) |
Black elastomer |
| Mix Ratio (A:B) |
10 : 1 (by weight) |
| Viscosity (A/B) |
Component A: 2000-2800 cP, Component
B: 20-30 cP (GB/2794-1995)
|
| Density |
1.42±0.02 g/cm³ (GB/2794-1995) |
| Pot Life (25°C) |
40-60 minutes |
| Cure Time (25°C) |
4-6 hours (tack-free), 24 hours (full cure) |
| Hardness (Shore A) |
30-40 (GB/T531-1999) |
| Dielectric Strength |
≥14 kV/mm |
Product Highlights for Silicone Potting Compound:
• Efficient Thermal Management: Great thermal conductivity cools power components (MOSFETs, IGBTs) by 10–30°C.
• EMI Shielding: Reduces electromagnetic radiation and optimizes EMC performance.
• Strong Adhesion: Optimized for aluminum and other metal surfaces to avoid separation under thermal cycling.
• Multi-Environment Protection: Waterproof, moisture-proof, dust-proof and resistant to chemical vapor for harsh applications.
• Good Flame Retardancy: Silicone matrix with flame resistance upgrades the safety of finished devices.
Application Areas for Silicone Potting Compound:
• High-power LED drivers, automotive HID ballasts
• On-board chargers (OBC) and motor controllers for new energy vehicles
• Industrial power supplies, servo drives
• PV inverters, power modules for telecommunication base stations
Detailed Operating Guide for Silicone Potting Compound:
1. Surface Preparation Thoroughly clean substrates such as aluminum heat sinks and housings to remove oil, dust and oxide layers, ensuring maximum thermal conductivity and bonding strength.
2. Precise Proportioning Weigh Part A and Part B strictly at a 10:1 weight ratio using a precision scale (0.1g accuracy) to guarantee stable curing and consistent performance.
3. Uniform Mixing Stir the two components thoroughly in a clean container for no less than 3 minutes. Scrape the container bottom and sides fully to blend settled fillers and achieve a homogeneous mixture.
4. Vacuum Degassing Degas the blended compound under -0.095 MPa vacuum for 3–5 minutes. This effectively eliminates trapped air bubbles, preventing localized overheating caused by voids in deep potting applications.
5. Potting & Curing Pour the compound slowly into electronic assemblies. Mild vibration can assist defoaming and leveling. Cure at room temperature (25°C). The product reaches initial curing for handling quickly, while full thermal and mechanical properties are completely stabilized after 7 days.
Packaging & Storage for Silicone Potting Compound:
1. Standard Packaging: 22kg/set (20kg A + 2kg B); 11kg/set (10kg A + 1kg B).
2. Storage Conditions: Store in a cool, dry place away from direct sunlight. Ideal storage temperature: 10-30°C.
3. Shelf Life: 6 months in original, unopened containers from date of manufacture.
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