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Thermally Conductive Potting Compound HN-8820-IND 2.0W/mK Silicone Encapsulant for Charging Pile LED Driver Industrial

Thermally Conductive Potting Compound HN-8820-IND 2.0W/mK Silicone Encapsulant for Charging Pile LED Driver Industrial

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: Hanast
Certification: UL 94 V-0, RoHS, REACH, ISO 9001
Model Number: HN-8820-IND
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
Hanast
Certification:
UL 94 V-0, RoHS, REACH, ISO 9001
Model Number:
HN-8820-IND
Mix Ratio:
1:1 (A:B)
Color:
Black
Viscosity:
5000-8000 CPs
Thermal Conductivity:
2.0 W/mK
Dielectric Strength:
>25 KV/mm
Flame Retardant Rating:
UL 94 V-0
Hardness:
45-50 Shore A
Pot Life:
6-12Month
Highlight:

High Light

Highlight:

Charging Pile PCB Protection Encapsulant

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LED Driver Waterproof Potting Manufacturer

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Low Viscosity Fast Cure Silicone Potting

Trading Information
Minimum Order Quantity:
1 KG
Price:
Negotiable
Packaging Details:
50 kg/set (A: 25 kg + B: 25 kg drums), industrial bulk packaging for automatic dispensing systems available
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
500 KG per Month
Product Description
Thermally Conductive Potting Compound HN-8820-IND 2.0W/mK Silicone Encapsulant for Charging Pile LED Driver Industrial
Product Overview

HN-8820-IND is a low-viscosity two-part addition-cure silicone potting compound specifically formulated for EV charging pile power modules, high-power LED driver encapsulation, industrial power supplies, and telecom equipment. With 2.0W/mK thermal conductivity, UL 94 V-0 flame retardancy, and excellent flow characteristics, this PCB protection potting compound fills tight spaces and complex geometries for complete electronic component protection.

Key Features for Industrial Electronics
  • Low Viscosity for PCB Potting: 5000-8000 cP viscosity with customizable lower options ensures complete penetration around SMD components and tight PCB clearances
  • Fast Cure Capability: Room temperature cure in 2-4 hours or accelerated at 80°C for high-throughput production lines
  • Moisture-Proof Sealing: Complete environmental barrier against humidity, condensation, and corrosive atmospheres
  • Anti-Vibration Damping: Flexible silicone absorbs mechanical shock and vibration for transportation and field-deployed equipment
  • Charging Pile Reliability: Engineered for 24/7 outdoor operation with excellent thermal cycling endurance
  • UL 94 V-0 Certified: Critical fire safety rating for high-power charging and industrial applications
  • Deep Section Cure: Addition-cure chemistry cures uniformly regardless of potting depth
Industrial & Infrastructure Applications
Application Key Requirement
EV Charging Piles/Stacks High-power DC module potting with thermal management and fire safety
High-Power LED Drivers Outdoor street light power supply waterproof encapsulation and heat dissipation
Industrial Power Supplies PCB-level protection for factory automation and machinery control units
Telecom Equipment RRU, baseband units, and network transformer moisture-proof potting
Sensor Modules Environmental sealing for industrial IoT and process control sensors
Automotive HID Lighting High-temperature ballast and igniter module encapsulation
Motor Drive Inverters Industrial VFD and servo drive power stage potting
Medical Power Supplies Low-outgassing clean room compatible electronic protection
PCB Protection Advantages: Silicone vs Alternatives
Protection Method Silicone Potting (HN-8820-IND) Conformal Coating Epoxy Potting
Coverage Complete 3D encapsulation Thin surface film only Complete but rigid
Moisture Barrier Excellent, full seal Moderate Excellent
Reworkability Removable for repair Difficult to remove Non-repairable
Thermal Management 2.0W/mK heat dissipation Minimal 0.5-1.0W/mK
Vibration Protection Shock absorbing Minimal Rigid, may crack
Production Speed Fast RT cure or 80°C accelerated Multiple coats, slow dry Long cure cycles
Custom Formulation & Bulk Supply

As a specialized charging pile potting compound manufacturer in Shenzhen, Guangdong, our factory delivers:

  • Lower viscosity options: Custom formulated to 2000-4000 cP for tight-pitch PCB assemblies
  • Faster cure profiles: Adjustable pot life and cure time for automated production lines
  • Bulk competitive pricing: Factory-direct from Guangdong, China with 50,000 KG/month capacity
  • 1KG MOQ for samples: Low minimum order for application testing and validation
  • Complete documentation: TDS, MSDS, RoHS/REACH certificates provided with every shipment
  • Technical support: Application engineering guidance for dispensing process optimization
Technical Specifications
Parameter Specification
Mix Ratio 1:1 (A:B) by weight
Viscosity (Mixed) 5000-8000 cP (customizable to 2000 cP)
Pot Life (25°C) 6-12 Month
Cure Time (25°C) 4-6 hours
Accelerated Cure (80°C) 30-60 minutes
Hardness 45-50 Shore A
Thermal Conductivity 2.0 W/mK
Dielectric Strength >25 kV/mm
Volume Resistivity >5.0E14 Ohm.cm
Flame Retardant Rating UL 94 V-0
Operating Temperature -40°C to 150°C
Packaging & Logistics
  • Standard: 50 kg/set (25 kg Part A + 25 kg Part B drums)
  • Bulk: 200 kg industrial drums for high-volume automatic dispensing lines
  • MOQ: 1 KG sample, volume pricing for bulk orders
  • Shelf life: 6 months in cool, dry storage
  • Global shipping: Full export documentation with MSDS and dangerous goods certification

Contact our factory today for charging pile LED driver potting compound pricing per kg, free 1KG samples, or custom viscosity formulation. ISO 9001 certified, RoHS and REACH compliant manufacturer from Shenzhen, China.