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Silicone Encapsulant HN-8820 2.0W/mK Thermal Potting Compound for Automotive Electronics Motor Drive RF Module

Silicone Encapsulant HN-8820 2.0W/mK Thermal Potting Compound for Automotive Electronics Motor Drive RF Module

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: Hanast
Certification: UL 94 V-0, RoHS, REACH, ISO 9001
Model Number: HN-8820
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
Hanast
Certification:
UL 94 V-0, RoHS, REACH, ISO 9001
Model Number:
HN-8820
Mix Ratio:
1:1 (A:B)
Color:
Black,grey,white
Viscosity:
5000-8000 CPs
Pot Life:
6-12Month
Cure Time:
4-6 H
Heat Cure:
10-20 Min At 80C
Thermal Conductivity:
2.0 W/mK
Flame Retardant Rating:
UL 94 V-0
Hardness:
45-50 Shore A
Solvent Content:
Solvent Free
Highlight:

High Light

Highlight:

Solvent Free Flexible Thermal Encapsulant

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Motor Drive RF Module Potting Gel

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Automotive Electronics Adhesion Protection

Trading Information
Minimum Order Quantity:
1 KG
Price:
Negotiable
Packaging Details:
50 kg/set (A: 25 kg + B: 25 kg drums), export-grade industrial packaging
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
500KG per Month
Product Description
Silicone Encapsulant HN-8820 2.0W/mK Thermal Potting Compound for Automotive Electronics Motor Drive RF Module
Product Overview

HN-8820 is a solvent-free two-part addition-cure silicone encapsulant manufactured by Shenzhen Hanast New Material Co., Ltd. Engineered for automotive electronics encapsulation, motor drive controller potting, RF communication module protection, and consumer electronics, this flexible thermal potting gel delivers 2.0W/mK thermal conductivity with excellent substrate adhesion and thermal cycling resistance. UL 94 V-0 certified with simple 1:1 processing and optional 80°C heat cure acceleration.

Key Performance Features
  • Solvent-Free Formula: Zero VOC emissions, safe for enclosed electronic assemblies and clean room environments
  • Excellent Substrate Adhesion: Bonds reliably to PCB, aluminum, copper, and most engineering plastics without primer
  • Flexible & Elastic: Permanent rubber-like flexibility absorbs thermal expansion mismatches and mechanical stress
  • Thermal Cycling Resistance: Maintains integrity through repeated -60°C to 200°C temperature cycles without cracking
  • Overheating Protection: 2.0W/mK conductivity prevents hot-spot formation in high-power density electronics
  • Fast Heat Cure Option: 10-20 minutes at 80°C for high-throughput automated production lines
  • Self-Extinguishing: UL 94 V-0 rated, stops burning immediately after flame removal
  • High Density Fill: 2.36 g/cm³ ensures complete void-free encapsulation for maximum thermal transfer
Application Scenarios
Application Protection Benefit
Automotive ECU Modules Engine bay thermal cycling and vibration resistant encapsulation
Motor Drive Controllers IGBT/MOSFET thermal management and electrical insulation for VFD and servo drives
Battery Management Systems BMS circuit board moisture-proof and overheating protection
RF Communication Modules Low-loss dielectric encapsulation for 5G and telecom RF power amplifiers
Consumer Electronics Power adapter, charger, and smart home device potting with safety compliance
Automotive Sensors Under-hood sensor module environmental sealing and heat dissipation
Industrial Automation PLC, HMI, and factory control electronics long-term protection
Thermal Management Solution Comparison
Solution Thermal Conductivity Electrical Insulation Environmental Seal Reworkable
HN-8820 Silicone Encapsulant 2.0 W/mK Excellent Complete Yes
Thermal Gap Filler Pad 1.0-5.0 W/mK Limited None Yes
Thermal Grease/Paste 1.0-8.0 W/mK None None Yes
Epoxy Encapsulant 0.5-1.5 W/mK Good Complete No
Custom Formulation & OEM Supply

As a direct silicone encapsulant manufacturer in Shenzhen, Guangdong, we provide:

  • Adjustable viscosity: Custom formulated for specific dispensing and flow requirements
  • Cure speed customization: Optimized pot life and cure profiles for automated production
  • Hardness tuning: 35-55 Shore A range available for different flexibility needs
  • Bulk supply: 500 KG/month with batch-to-batch consistency guarantee
  • Free 1KG sample: Application testing with complete TDS and MSDS documentation
  • MOQ from 1KG: Low minimum order for prototyping before scaling to volume production
  • Private label OEM: Custom packaging and branding for your product line
Technical Specifications
Parameter Specification
Mix Ratio 1:1 (A:B) by weight
Viscosity (Mixed)

5000-8000 cPs

Pot Life (25°C) 6-12Month
Cure Time (25°C) 4-6 hours
Heat Cure (80°C) 10-20 minutes
Hardness 45-50 Shore A
Thermal Conductivity 2.0 W/mK
Flame Retardant Rating UL 94 V-0 (self-extinguishing)
Solvent Content 0% (solvent-free formulation)
Packaging & Storage
  • Standard: 50 kg/set (25 kg Part A + 25 kg Part B drums)
  • Resealable packaging: Tightly reseal after use; use within 6-month shelf life
  • MOQ: 1 KG for sample orders, volume pricing available
  • Storage: Cool, dry environment away from sulfur, tin, amines, and acidic substances
  • Global export: Complete shipping documentation with MSDS and transport certificates
Contact our Shenzhen factory today for silicone encapsulant pricing per kg, free 1KG samples, or custom formulation consultation. ISO 9001 certified, RoHS and REACH compliant, solvent-free manufacturer.