HN-8808 A/B is a two-component condensation-cure (RTV-2) liquid silicone potting compound supplied in a 10:1 ratio. After mixing Component A and Component B at 10:1 by weight, the compound cures at room temperature into a transparent, high-performance elastomer for potting and encapsulation of power modules, PCBs and electronic assemblies. The cured material features good adhesion, no corrosion, small chemical shrinkage, no exotherm during cure and excellent electrical insulation over a wide operating temperature range.
| Property | Value |
|---|---|
| Model | HN-8808 A/B |
| Cure Type | Two-component condensation cure (RTV-2), room temperature |
| Mix Ratio (A:B) | 10:1 by weight |
| Appearance | Transparent liquid |
| Viscosity Component A (25°C) | 2200-2600 mPa·s |
| Viscosity Component B (25°C) | 20-30 mPa·s |
| Density (Component A) | 0.94 ±0.02 g/cm³ |
| Dielectric Strength | ≥14 kV/mm |
| Dielectric Constant | ≤3.0 |
| Elongation at Break | ≤100% |
| Operating Temperature | -50°C to 200°C |
| Full Cure Time (25°C) | 8-24 hours |
| Shelf Life | 6 months |
| Packaging | 22kg/set (20kg A + 2kg B) or 11kg/set (10kg A + 1kg B) |
As a direct silicone potting compound manufacturer, Hanast supports OEM and ODM customization of hardness, viscosity, curing time and flame retardancy, and provides an SDS on request. Wholesale and factory-direct pricing, bulk iron-drum packaging and private-label supply are available for high-volume production lines.
Supplied as Component A (20kg or 10kg iron/plastic drum) together with Component B (2kg or 1kg plastic bottle), or as ready 10:1 kits of 22kg/set or 11kg/set. Keep components sealed in a cool, dry, ventilated place below 25°C, protected from direct sunlight and moisture. Shelf life is 6 months; best used within 3 months. Classified as non-dangerous goods for transport.
Q1: What is HN-8808 A/B and which applications does it suit?
A1: HN-8808 A/B is a 10:1 two-component condensation-cure liquid silicone potting compound. It suits potting of power modules, PCBs, LED power supplies, waterproof power supplies, automotive electronic modules (ECU) and general electronic encapsulation.
Q2: What is the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 10:1 ratio by weight. The compound cures at room temperature, with full cure in 8-24 hours at 25°C. After initial cure, gentle heating not exceeding 60°C may be used to accelerate curing.
Q3: Is it flame retardant and what is the dielectric strength?
A3: HN-8808 is a flame retardant formulation for power module and power supply safety. Its dielectric strength is 14 kV/mm or more with a dielectric constant of 3.0 or less, providing reliable insulation for high-voltage electronics.
Q4: Does it need a primer for good adhesion?
A4: No. HN-8808 offers primerless adhesion to aluminium and many other substrates including iron, acrylic and PC plastics, with non-corrosive curing that does not attack metal parts.
Q5: What certifications, MOQ and packaging are available?
A5: HN-8808 is RoHS and REACH compliant with an SDS available, and is classified as non-dangerous goods. It is supplied in 22kg/set or 11kg/set 10:1 kits, with wholesale and OEM/ODM bulk supply supported.
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