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10:1 Transparent Silicone Potting Compound Flame Retardant High Dielectric Strength for Power Module

10:1 Transparent Silicone Potting Compound Flame Retardant High Dielectric Strength for Power Module

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: HANAST
Certification: RoHS, REACH, SDS available
Model Number: HN-8808 A/B
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
HANAST
Certification:
RoHS, REACH, SDS available
Model Number:
HN-8808 A/B
Model:
HN-8808 A/B
Type:
Two Component Condensation Cure (RTV-2) Silicone Potting Compound
Mix Ratio:
10:1 By Weight
Cure Schedule:
Room Temperature Cure; Full Cure 8-24 Hours At 25 C
Appearance:
Transparent Liquid
Viscosity Component A:
2200-2600 MPa.s At 25 C
Viscosity Component B:
20-30 MPa.s At 25 C
Density:
0.94 +/- 0.02 G/cm3
Dielectric Strength:
>=14 KV/mm
Dielectric Constant:
<=3.0
Elongation At Break:
<=100%
Operating Temperature:
-50 C To 200 C
Flame Retardant:
Yes (flame Retardant Formulation)
Adhesion:
Primerless Adhesion To Aluminium, Iron, Acrylic And PC
Compliance:
RoHS, REACH, Halogen Free; SDS Available
Safety Classification:
Non-hazardous (general Chemical)
Packaging:
22kg/set (20kg A + 2kg B) Or 11kg/set (10kg A + 1kg B)
Shelf Life:
6 Months
Highlight:

High Light

Highlight:

Custom OEM Flame Retardant Potting Compound

,

Wide Temperature Non-Corrosive Silicone Encapsulant

,

RoHS REACH High Dielectric Potting Gel

Trading Information
Minimum Order Quantity:
1 kg
Price:
Negotiable
Packaging Details:
22kg/set (20kg drum A + 2kg bottle B) or 11kg/set (10kg + 1kg), sealed containers, shipped by air or sea
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Payment Terms:
T/T,L/C,Western Union,PayPal
Supply Ability:
120 Tons per Month
Product Description

HANAST HN-8808 A/B Transparent Silicone Potting Compound

HN-8808 A/B is a two-component condensation-cure (RTV-2) liquid silicone potting compound supplied in a 10:1 ratio. After mixing Component A and Component B at 10:1 by weight, the compound cures at room temperature into a transparent, high-performance elastomer for potting and encapsulation of power modules, PCBs and electronic assemblies. The cured material features good adhesion, no corrosion, small chemical shrinkage, no exotherm during cure and excellent electrical insulation over a wide operating temperature range.

Key Features

  • 10:1 mix ratio by weight with room-temperature curing for easy operation
  • Transparent cured elastomer for visual inspection of potted components
  • High dielectric strength of 14 kV/mm or more with dielectric constant of 3.0 or less
  • Wide operating temperature range from -50°C to 200°C
  • Good adhesion to aluminium, iron, acrylic and PC substrates with primerless bonding
  • Non-corrosive, no exotherm and small chemical shrinkage protect delicate electronic parts
  • Waterproof and moisture proof, protecting electronic assemblies from humidity
  • Flame retardant formulation engineered for power module and power supply safety
  • Non-toxic and non-hazardous, supplied as a general chemical; RoHS and REACH compliant with SDS available
  • Deep-section through cure, full cure in 8-24 hours at 25°C
  • 6 months shelf life with stable storage and easy shipping

Typical Applications

  • Potting protection of circuit boards (PCBs) and LED power supplies
  • Power modules, AC-DC converters, DC-DC modules, motor drives and inverter boards
  • Waterproof power supplies and automotive electronic modules (ECU, sensors, actuators)
  • Electrical appliances, light sources, lamps and their accessories
  • Aluminium substrate potting requiring strong adhesion
  • Solar photovoltaic junction boxes and industrial sensor sealing
  • General electronic encapsulation requiring transparent, waterproof and insulating protection

Technical Data (per TDS HANAST-TDS-027)

PropertyValue
ModelHN-8808 A/B
Cure TypeTwo-component condensation cure (RTV-2), room temperature
Mix Ratio (A:B)10:1 by weight
AppearanceTransparent liquid
Viscosity Component A (25°C)2200-2600 mPa·s
Viscosity Component B (25°C)20-30 mPa·s
Density (Component A)0.94 ±0.02 g/cm³
Dielectric Strength≥14 kV/mm
Dielectric Constant≤3.0
Elongation at Break≤100%
Operating Temperature-50°C to 200°C
Full Cure Time (25°C)8-24 hours
Shelf Life6 months
Packaging22kg/set (20kg A + 2kg B) or 11kg/set (10kg A + 1kg B)

OEM / ODM Customization & Bulk Supply

As a direct silicone potting compound manufacturer, Hanast supports OEM and ODM customization of hardness, viscosity, curing time and flame retardancy, and provides an SDS on request. Wholesale and factory-direct pricing, bulk iron-drum packaging and private-label supply are available for high-volume production lines.

Packaging & Storage

Supplied as Component A (20kg or 10kg iron/plastic drum) together with Component B (2kg or 1kg plastic bottle), or as ready 10:1 kits of 22kg/set or 11kg/set. Keep components sealed in a cool, dry, ventilated place below 25°C, protected from direct sunlight and moisture. Shelf life is 6 months; best used within 3 months. Classified as non-dangerous goods for transport.

FAQ

Q1: What is HN-8808 A/B and which applications does it suit?
A1: HN-8808 A/B is a 10:1 two-component condensation-cure liquid silicone potting compound. It suits potting of power modules, PCBs, LED power supplies, waterproof power supplies, automotive electronic modules (ECU) and general electronic encapsulation.

Q2: What is the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 10:1 ratio by weight. The compound cures at room temperature, with full cure in 8-24 hours at 25°C. After initial cure, gentle heating not exceeding 60°C may be used to accelerate curing.

Q3: Is it flame retardant and what is the dielectric strength?
A3: HN-8808 is a flame retardant formulation for power module and power supply safety. Its dielectric strength is 14 kV/mm or more with a dielectric constant of 3.0 or less, providing reliable insulation for high-voltage electronics.

Q4: Does it need a primer for good adhesion?
A4: No. HN-8808 offers primerless adhesion to aluminium and many other substrates including iron, acrylic and PC plastics, with non-corrosive curing that does not attack metal parts.

Q5: What certifications, MOQ and packaging are available?
A5: HN-8808 is RoHS and REACH compliant with an SDS available, and is classified as non-dangerous goods. It is supplied in 22kg/set or 11kg/set 10:1 kits, with wholesale and OEM/ODM bulk supply supported.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

I
I*y
India Aug 6.2026
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.