HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound developed for the electronics and electrical industry. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. It combines high dielectric strength, high compressive and bonding strength, and excellent acid/alkali, moisture and humid-heat ageing resistance, making it a dependable choice for encapsulating and protecting transformers, power supplies, sensors and other electronic components.
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| Parameter | Value |
|---|---|
| Type | Two Component Epoxy Potting Compound (high hardness / encapsulation grade) |
| Appearance before mixing | Component A: black or white viscous epoxy resin; Component B: reddish / transparent low-viscosity liquid |
| Density | A 1.4-1.5 g/cm3; B 1.05 g/cm3 |
| Mix ratio (by weight) | A : B = 5 : 1 |
| Pot life / working time | 2-3 h at 25°C (100 g mix) |
| Cure schedule | 25°C: 6-8 h tack-free, 12-16 h fully cured; or 60-80°C: 1.5-2 h |
| Hardness (cured) | Shore D 85-95 |
| Dielectric strength | 20-22 kV/mm |
| Volume resistivity | 1.1 x 1015 ohm.cm |
| Tensile strength | 16-18 kg/cm2 |
| Compressive strength | 18-22 kg/cm2 |
| Shrinkage | 0.35-0.55% |
| Water absorption | < 0.03% (25°C x 24 h) |
| Heat distortion temperature | 130-150°C |
| Low temperature resistance | -30°C |
| Compliance | RoHS compliant; non-dangerous goods; SDS available |
| Packaging | Component A 25 kg plastic barrel + Component B 5 kg plastic pot, 30 kg/set kit |
| Shelf life | 6 months in sealed containers at 25°C |
HN-5508 A/B is widely used for potting and protection of electronic and electrical components: transformers, power supply modules, resistors, filters, temperature sensors, temperature controllers, high-voltage ignition coils, high-voltage packages, circuit boards (PCB), aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It also suits harsh-environment and outdoor electronics that require acid/alkali resistance, moisture proofing and reliable insulation.
Hanast is a direct potting compound factory based in Guangdong, China, with a dedicated R&D laboratory. We offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific transformer, power supply or sensor design, with samples delivered in 3-5 working days, bulk supply and factory-direct pricing. Bulk epoxy encapsulant supply is available across Asia and worldwide.
Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.
Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.
We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.
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Q1: What is HN-5508 A/B and which applications does it suit?
A1: HN-5508 A/B is a 5:1 two-component black epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength. It is designed for encapsulating transformers, power supply modules, resistors, filters, sensors, temperature controllers, high-voltage ignition coils and circuit boards.
Q2: What are the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); it is tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C for accelerated cure.
Q3: What are its electrical insulation and temperature performance?
A3: It offers high dielectric strength of 20-22 kV/mm and volume resistivity of 1.1 x 1015 ohm.cm, with a heat distortion temperature of 130-150°C and low-temperature resistance down to -30°C, plus acid/alkali and moisture resistance for harsh environments.
Q4: Is HN-5508 A/B RoHS compliant, and can it be customized?
A4: Yes. HN-5508 A/B is RoHS compliant and classified as non-dangerous goods. We provide custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to suit your application.
Q5: What are the MOQ, packaging and delivery time?
A5: Minimum order quantity is 1 kg, supplied in 25 kg (A) + 5 kg (B) 30 kg/set kits. Samples ship in 3-5 working days and bulk orders in 7-15 days, with bulk epoxy encapsulant supply available across Asia and worldwide.