0.76 W/mK Thermal Conductivity 1:1 Mix Ratio UL 94 V-0 Flame Retardant Silicone Potting Compound for Power Module Heat Dissipation

HN-8806A/B is a two-component addition-cure silicone potting compound mixed 1:1 by weight, formulated as a thermally conductive potting material for power electronics. The cured grey Shore A 45 ± 5 elastomer provides 0.76 W/m·K thermal conductivity per TDS HANAST-TDS-004 Rev.1, creating a continuous heat path from power devices and windings into housings, heat sinks and cold plates. It also delivers 25-30 kV/mm dielectric strength, 1.0 × 10¹⁶ Ω·cm volume resistivity, UL 94 V-0 halogen-free flame retardancy, a −50 °C to 250 °C service range and CTE 210 µm/(m·°C). Addition cure releases no heat and no by-products with extremely low shrinkage, so thermal cycling does not stress components or solder joints.

• 0.76 W/m·K thermal conductivity (TDS value) – conducts heat from IGBTs, MOSFETs, transformer cores and LED boards into the housing or heat sink, lowering component temperatures in potted power assemblies.
• Continuous thermal path without voids – the 2000-3000 mPa·s mix fills dense component arrays and narrow gaps, and vacuum degassing removes air so heat does not cross insulating voids.
• 25-30 kV/mm dielectric strength – combines heat transfer with high electrical insulation for busbars, terminals, windings and high-voltage traces.
• 1.0 × 10¹⁶ Ω·cm volume resistivity – stable insulation resistance for power modules, EV electronics and industrial power equipment.
• UL 94 V-0 halogen-free flame retardancy – V-0 classification with RoHS and REACH compliance for EU and North American OEM documentation.
• CTE 210 µm/(m·°C) and low-stress cure – no exotherm and extremely low shrinkage keep the thermal interface stable through power cycling and thermal shock.
• Wide −50 °C to 250 °C service range – retains elasticity from cold outdoor installation to high-temperature power operation.
• 1:1 mix ratio and 18-24 min pot life – equal-part dosing for manual pots or direct 1:1 meter-mix dispensing.
• 12 min at 80 °C or 2-3 h at 25 °C – heat-accelerated cure for volume lines, room-temperature cure for large cavities and repair work.
• Deep-section curing – thick power modules and large castings cure through the section without voids or incomplete cure.
• Ageing resistance and non-corrosive – no attack on copper, aluminium or plated terminals, with stable thermal and electrical performance over service life.
• 50 kg bulk kit – Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, with TDS, MSDS, RoHS and REACH declarations and batch COA.

All values are measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule and are for reference only. Actual performance may vary with application conditions.

• Pre-mix – stir Component A and Component B separately before use, because fillers may settle during storage; reseal containers tightly after use.
• Weigh or meter – weigh A and B at exactly 1:1 by weight on a precision scale, or run the pair through a 1:1 meter-mix dispenser.
• Mix – mix thoroughly in the same direction to limit air entrapment and scrape the container walls and bottom; uneven mixing may cause local incomplete cure.
• Degas – vacuum degas before potting; air voids interrupt the thermal path and reduce dielectric withstand.
• Pot – pour or dispense the mixed compound into the clean, dry device within the 18-24 minute pot life, ensuring contact with the heat-generating surfaces.
• Cure – 12 minutes at 80 °C on heat-accelerated lines, or 2-3 hours at 25 °C; do not move or stress the part during cure.

Cure inhibition notice: this addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting, and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.

HN-8806A/B is specified for thermal management, heat dissipation and insulation in the following assemblies:

power moduleIGBT moduleMOSFET moduleSiC power devicethyristorrectifier bridgeDC-DC converterOBC on-board chargerinvertermotor driveservo drivePV inverterwind power converterswitching power supplyindustrial power supplyUPS module

EV battery packbattery moduleBMS boardcharging pilecharging moduleESS battery rackPCS cabinetBESS thermal managementsolar combiner boxphotovoltaic junction box

LED driverLED power supplyLED moduleoutdoor lighting driverelectronic ballastmotor statormotor coilpump electronicstransformerinductorreactorheat sink assembly

PCBAconnectorterminal blockrelaysensor boardtemperature sensorPLC moduleindustrial controllerinstrument modulesmart meterenergy meter5G base station powertelecom rectifierserver and data center PSUautomotive ECUhousehold appliance control boardpower tool controllerwelding machine power stage

• Standard bulk kit – Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per A+B set.
• Pallet and export packing – barrels palletised and strapped for sea and air freight; private label and drum marking available.
• Documentation – TDS, MSDS, RoHS and REACH declarations and batch COA issued with every shipment.
• Storage – 25 °C in original tightly sealed containers, protected from direct sunlight, moisture and extreme temperatures.
• Shelf life – 6 months from date of manufacture when stored unopened and properly sealed; inspect and test material past shelf life before use.
• Transport – classified as non-dangerous goods (general chemicals); handle with care to prevent leakage.
• Supply capacity – 50 tons per month with OEM and private label service.

Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone materials at its Guangdong base and supplies addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements. TDS reference: HANAST-TDS-004 Rev.1 (2024-08-30).