2.00 W/mK Thermal Grease with Low Thermal Resistance and Non-Curing Thermal Paste for Voltage Regulator Cooling

HN200 is a single-component, non-curing silicone thermal grease engineered for high power density assemblies. With thermal conductivity above 2.0 W/m·K and thermal resistance of 0.82 °C·cm²/W at 25 PSI (ASTM D5470), it transfers heat efficiently from power components to heat sinks while maintaining excellent electrical insulation. The high-density 3.04 g/cm³ filler loading resists oil separation and pump-out, keeping thermal performance stable from −50 °C to +200 °C.

• High thermal conductivity: 2.05 ± 0.1 W/m·K (ASTM D5470)
• Low thermal resistance: 0.82 °C·cm²/W at 25 PSI, ideal for thin bond lines
• High filler loading: specific gravity 3.04 ± 0.08 g/cm³ for dense, stable contact
• Oil separation resistance: ≤ 0.5% and volatility ≤ 0.8% at 200 °C / 24 h
• Non-curing: keeps paste consistency indefinitely, no hardening, no drying
• Electrical insulation: breakdown voltage 2450 V/mm at 0.20 mm (IEC 60243)
• Near-zero ionisation: resistant to water, ozone and weathering
• Compliance: RoHS 2.0, non-toxic, odourless and non-corrosive

HN200 suits high-heat-flux electronic and electrical equipment across multiple industries:

• Voltage regulators and power supplies: regulated power supplies, voltage regulator modules, microwave power supplies, switching power supplies and power supply modules
• Power semiconductors: power transistors, thyristors, power modules, IGBT assemblies and heating elements
• Microwave and RF equipment: microwave devices, microwave communication systems and microwave transmission equipment, applied by surface coating or overall potting
• Automotive electronics: automotive electronic control units, automotive refrigerators, in-vehicle power modules and sensor housings
• Computing and imaging: CPU assemblies, GPU heat sinks, graphics cards, thermistors, temperature sensors and printer heads
• LED and lighting electronics: LED lighting fixtures, LED driver boards and electrical component heat dissipation interfaces
• General thermal hardware: heat sinks, heat exchange strips, housings and metal chassis requiring an insulating thermal interface

All values are measured under standard conditions and are for reference only. Actual thermal performance may vary with application conditions, bond line thickness (BLT) and contact pressure.

1. Surface preparation: clean all contact surfaces with a solvent to remove grease, dust and oxidation; ensure surfaces are completely dry.
2. Application: apply the grease directly by brushing, rolling, automatic dispensing or screen printing.
3. Spreading: transfer a small amount with a clean razor blade, plastic spatula or clean knife and spread evenly to the desired thickness.
4. Thickness control: the thinner the layer, the better the heat transfer. Remove excess material from the edges with a lint-free cloth.
5. Assembly: assemble the heat sink or heat source immediately and torque fasteners to specification to obtain a proper bond line thickness.

Q1: What thermal conductivity and thermal resistance does HN200 silicone grease provide?
A: HN200 achieves a thermal conductivity of 2.05 ± 0.1 W/m·K and a thermal resistance of 0.82 °C·cm²/W at 25 PSI, both measured by ASTM D5470. The high filler loading (specific gravity 3.04 ± 0.08 g/cm³) supports thin, stable bond lines on high power density assemblies.

Q2: Does HN200 cure, harden or dry out during long-term use?
A: No. HN200 is a single-component, non-curing silicone grease that keeps its paste consistency indefinitely. It shows no powdering after 8 days continuous baking at 200 °C and no drying after 3 hours at 280 °C, with oil separation ≤ 0.5% and volatility ≤ 0.8% at 200 °C for 24 hours.

Q3: Is HN200 electrically insulating and suitable for live power circuits?
A: Yes. HN200 offers a breakdown voltage of 2450 V/mm at 0.20 mm thickness (IEC 60243) together with near-zero ionisation, making it suitable for voltage regulators, switching power supplies, power modules and other live circuits that require both insulation and heat transfer.

Q4: Which applications and industries can use HN200 thermal grease?
A: HN200 is used for voltage regulators, regulated and switching power supplies, power transistors, thyristors and power modules, microwave devices and microwave communication equipment, automotive electronics and car refrigerators, CPU and GPU heat sinks, thermistors and temperature sensors, printer heads, LED lighting fixtures and general heat sink, heat exchange strip or housing thermal management.

Q5: How is HN200 applied, packaged and stored?
A: Clean and dry the surfaces, apply by brushing, rolling, automatic dispensing or screen printing, then assemble the heat sink immediately with controlled torque. HN200 is supplied in 1 kg and 5 kg plastic drums with custom sizes on request, and has a 12-month shelf life when stored unopened below 27 °C in a cool, dry, well-ventilated area. Stir before use if slight oil separation occurs.

• Packaging: 1 kg plastic drum, 5 kg plastic drum; custom package sizes available upon request
• Storage: keep containers tightly sealed in a cool, dry, well-ventilated area away from direct sunlight; recommended below 27 °C
• Shelf life: 12 months from date of manufacture when stored unopened and properly sealed
• Transportation: classified as non-dangerous goods; handle with care to prevent leakage

We are a source manufacturer of thermal conductive silicone materials with consistent batch quality, full TDS documentation and OEM/ODM support. Thermal conductivity, colour, viscosity, specific gravity and packaging can be customised to your specification, with technical samples available for evaluation.