1.0 W/mK Thermal Grease 2450 V/mm Insulation Wide Temperature Thermal Conductive Paste for Server Power Adapter Cooling

HN100 is a single-component, non-curing thermally conductive silicone grease built for long-term thermal interface service. It keeps its paste consistency from -50 C to +200 C, combines excellent electrical insulation (2450 V/mm) with stable thermal conductivity (1.0 W/mK), and offers near-zero free radical content with resistance to extreme temperature, water, ozone and weathering. The compound is safe, non-toxic, odourless, non-corrosive and RoHS 2.0 compliant, and its low specific gravity of 1.85 g/cm3 keeps dispensing weight and material cost predictable on high-volume assembly lines.

• 1.0 +/- 0.1 W/mK thermal conductivity to ASTM D5470 for stable heat transfer at an economical fill level.
• 2450 V/mm dielectric strength (IEC 60243, 0.20 mm) - among the highest insulation values in the HN grease range, suitable for live power assemblies requiring galvanic isolation.
• Wide service range -50 C to +200 C, non-curing, no hardening and no rework damage on repeated heat sink service.
• High-temperature stability: no powdering after 8 days continuous baking at 200 C; no drying after 3 h at 280 C on a 0.2 mm film.
• Low oil bleed and low volatility: oil separation max 0.3% and volatile matter max 0.6% at 200 C / 24 h, limiting pump-out and fogging inside sealed enclosures.
• Light specific gravity 1.85 g/cm3 with 370 +/- 20 penetration (1/10 mm) for repeatable dispensing volumes and stable automated application.

All values are measured under standard conditions and are for reference only. Actual thermal performance varies with application conditions, bond line thickness and contact pressure.

HN100 is used as the thermal interface between heat-generating components and heat dissipation parts (heat sinks, heat strips, housings) in electronic and electrical equipment, covering:

• Server, data center and telecom: server CPU and memory heat sinks, rack power shelves, base station units, power amplifiers, network switches, optical module housings.
• Power supply and conversion: power adapters, chargers, switching power supplies, regulated power supplies, power supply modules, inverters, UPS units, motor drives, power conversion cabinets.
• Power semiconductors: power transistors, thyristors, IGBT and MOSFET assemblies, rectifier bridges, solid state relays, power modules.
• Home appliance and industrial control: appliance control boards, induction cooker and inverter module interfaces, instrument housings, sensor and controller assemblies, heating elements and heat plates.
• Computing and consumer electronics: CPU assemblies, GPU and graphics card heat sinks, notebook and set-top box cooling, LED lighting fixtures and LED driver boards.
• Automotive and battery: automotive electronics, automotive refrigerators, EV battery pack interfaces, BMS boards, on-board charger modules.
• Sensing, printing and RF: thermistors, temperature sensors, thermal coupling surfaces, printer heads, plus surface coating or full encapsulation of microwave devices, microwave communication systems, microwave transmission equipment and microwave power supplies.

• Line-ready packaging: 1 kg and 5 kg plastic drums as standard; custom drum sizes, cartridges and syringe filling available on request.
• OEM / ODM: colour (white or grey), penetration and viscosity, filling weight and private-label printing can be customised for your programme.
• Documentation: TDS HANAST-TDS-018 Rev.1 and RoHS 2.0 statement supplied with each shipment; additional test reports on request.
• Capacity and lead time: 8000 kg monthly capacity, 3-5 working days for stock drums, 12-18 days for bulk production.
• Shelf life: 12 months from manufacture date in unopened original packaging stored below 27 C; stir thoroughly if minor oil separation occurs.

1. Clean contact surfaces with a solvent to remove grease, dust and oxidation, then dry completely.
2. Apply by brush, roller, automatic dispenser or screen printing and spread evenly to the required thickness.
3. Keep the layer as thin as possible - excess grease lowers heat transfer efficiency; wipe edges with a lint-free cloth.
4. Assemble the heat sink or heat source immediately and torque fasteners to specification to control bond line thickness.
5. Industrial use only: wear nitrile gloves and safety goggles, ensure ventilation, keep containers sealed and store away from food and children.