2.00 W/mK Thermal Conductive Grease Low Thermal Resistance Non-Curing Thermal Grease Paste for Power Transistor Cooling

HN200 is a single-component, non-curing thermal conductive silicone grease developed for high heat flux power assemblies. Its dense 3.04 g/cm³ filler package delivers 2.05 ± 0.1 W/m·K thermal conductivity with only 0.82 °C·cm²/W thermal resistance at 25 PSI, so heat moves efficiently from power transistors, thyristors and heating elements into heat sinks, heat exchange strips and housings. The paste remains stable from −50 °C to +200 °C, resists oil separation and pump-out, and provides 2450 V/mm electrical insulation for safe operation in live power circuits.

• High thermal conductivity: 2.05 ± 0.1 W/m·K (ASTM D5470)
• Low thermal resistance: 0.82 °C·cm²/W at 25 PSI for thin, efficient bond lines
• High density formulation: specific gravity 3.04 ± 0.08 g/cm³, resistant to pump-out and settling
• Non-curing: maintains paste consistency indefinitely; no hardening or drying
• Oil separation resistance: ≤ 0.5% and volatility ≤ 0.8% at 200 °C / 24 h
• Electrical insulation: breakdown voltage 2450 V/mm at 0.20 mm (IEC 60243)
• Thermal stability: no powdering after 8 days at 200 °C, no drying after 3 h at 280 °C
• Compliance: RoHS 2.0, non-toxic, odourless and non-corrosive

HN200 is formulated for high-power and high-temperature hardware where a stable, insulating thermal interface is critical:

• Power semiconductors: power transistors, thyristors, power modules, IGBT assemblies and rectifier stacks mounted on heat sinks
• Heating hardware: heating elements, heating plates, heat strips and heat exchange strips
• Power conversion: regulated power supplies, voltage regulators, switching power supplies and power supply modules
• Microwave and RF: microwave devices, microwave power supplies, microwave communication systems and microwave transmission equipment, applied by surface coating or overall potting
• Automotive electronics: automotive electronic control units, car refrigerators, in-vehicle power modules and sensor housings
• Computing and imaging: CPU assemblies, GPU heat sinks, graphics cards, thermistors, temperature sensors and printer heads
• Lighting electronics: LED lighting fixtures, LED driver boards and electrical component heat dissipation interfaces
• General hardware: heat sinks, metal housings and chassis requiring an insulating thermal interface

All values are measured under standard conditions and are for reference only. Actual thermal performance may vary with application conditions, bond line thickness (BLT) and contact pressure.

1. Surface preparation: clean all contact surfaces with a solvent to remove grease, dust and oxidation; ensure surfaces are completely dry.
2. Application: apply directly by brushing, rolling, automatic dispensing or screen printing.
3. Spreading: transfer a small amount with a clean razor blade, plastic spatula or clean knife and spread evenly to the required thickness.
4. Thickness control: keep the bond line as thin as possible; wipe excess from edges with a lint-free cloth.
5. Assembly: mount the heat sink, heat exchange strip or housing immediately and torque fasteners to specification for a uniform bond line.

• Packaging: 1 kg plastic drum, 5 kg plastic drum; custom package sizes available upon request
• Storage: keep containers tightly sealed in a cool, dry, well-ventilated area away from direct sunlight; recommended below 27 °C
• Shelf life: 12 months from date of manufacture when stored unopened and properly sealed
• Transportation: classified as non-dangerous goods; handle with care to prevent leakage

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

We are a source manufacturer of thermal conductive silicone materials with consistent batch quality, complete TDS documentation and OEM/ODM support. Thermal conductivity, colour, viscosity, specific gravity and packaging can be customised to your process, and technical samples are available for evaluation.