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3.0 W/mK Non-Curing Electrically Insulating Thermal Grease Thermal Conductive Silicone Grease for Inverter Server Power Cooling

3.0 W/mK Non-Curing Electrically Insulating Thermal Grease Thermal Conductive Silicone Grease for Inverter Server Power Cooling

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: HANAST
Certification: RoHS 2.0
Model Number: HN300
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
HANAST
Certification:
RoHS 2.0
Model Number:
HN300
Thermal Conductivity:
3.0 +/- 0.1 W/mK
Thermal Resistance:
0.82 C Cm2/W @ 25 PSI
Operating Temperature:
-40 C To +180 C
Breakdown Voltage:
1850 V/mm
Penetration:
350 +/- 20 1/10 Mm
Specific Gravity:
2.5 +/- 0.08 G/cm3
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High Temperature Stable Thermal Grease

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Automatic Dispensing Thermal Grease Paste

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Bulk Drum Heat Sink Compound

Trading Information
Minimum Order Quantity:
1 Drum (1 kg)
Packaging Details:
1 kg and 5 kg plastic drum as standard; custom drum sizes and private-label packaging available on request
Delivery Time:
3-5 working days for stock, 12-18 days for bulk production
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
5000 kg per Month
Product Description
HN300 High Thermal Conductive Silicone Grease

HN300 is a single-component, non-curing, high thermal conductivity insulating silicone grease developed for production-line heat dissipation of power electronics. It almost never cures, keeps its paste state from -40 C to +180 C, and combines excellent electrical insulation with 3.0 W/mK thermal conductivity. With near-zero free radical content it resists high and low temperatures, water, ozone and weathering, delivers low oil separation and low volatility at 200 C, and is safe, non-toxic, odourless, non-corrosive and RoHS 2.0 compliant.

3.0 W/mK Non-Curing Electrically Insulating Thermal Grease Thermal Conductive Silicone Grease for Inverter Server Power Cooling

Key Performance Highlights
  • 3.0 +/- 0.1 W/mK thermal conductivity tested to ASTM D5470, thermal resistance as low as 0.82 C cm2/W at 25 PSI for thin bond line assembly.
  • Non-curing paste: maintains dispensing consistency indefinitely, no hardening, no rework damage at service temperature -40 C to +180 C.
  • 1850 V/mm dielectric strength (IEC 60243, 0.20 mm) for electrically insulating interfaces on live IGBT, thyristor and power module assemblies.
  • Long-term thermal stability: no powdering after 8 days continuous baking at 200 C, no drying after 5-6 h at 280 C on 0.2 mm film.
  • Low oil bleed and low volatility: oil separation max 0.3%, volatile matter max 0.7% at 200 C / 24 h, minimising pump-out and fogging in sealed enclosures.
  • Process ready: suitable for brushing, rolling, automatic dispensing and screen printing, with 350 +/- 20 penetration (1/10 mm) for stable dispensing volumes.
Technical Specifications
Property Test Method / Condition Unit Value
Appearance Visual inspection - Grey, glossy, fine paste
Thermal Conductivity ASTM D5470 W/mK 3.0 +/- 0.1
Thermal Resistance ASTM D5470 @ 25 PSI C cm2/W 0.82
Specific Gravity GB/T 13354-1992 / 25 C g/cm3 2.5 +/- 0.08
Oil Separation (Oil Bleed) SH/T 0324-1992 / 200 C, 24 h % Max 0.3
Volatile Matter SH/T 0337-92 / 200 C, 24 h % Max 0.7
Penetration (Cone Penetration) GB/T 269-2023 / 25 C 1/10 mm 350 +/- 20
High-Temperature Stability 200 C constant-temperature oven, 8 days, 0.2 mm film - No powdering
Temperature Resistance Heating platform, 280 C, 0.2 mm film - No drying after 5-6 h
Breakdown Voltage IEC 60243, 0.20 mm thickness V/mm 1850
Operating Temperature Range - C -40 to +180

All values are measured under standard conditions and are for reference only. Actual thermal performance varies with application conditions, bond line thickness and contact pressure.

Application Coverage

HN300 is formulated for the thermal interface between heat-generating elements and heat dissipation hardware in electronic and electrical equipment, including:

  • Power semiconductor cooling: IGBT modules, power modules, power transistors, thyristors, MOSFET assemblies, rectifier bridges, solid state relays.
  • Power conversion equipment: inverters, servo drives, motor drives, variable frequency drives, solar inverters, UPS systems, welding machines, EV charging piles, switching power supplies, voltage regulators, power supply modules.
  • Computing and data infrastructure: CPU and GPU heat sinks, server and data center boards, telecom base station units, power amplifiers, high density graphics cards.
  • Sensing and instrumentation: thermistors, temperature sensors, thermal coupling surfaces, printer heads and thermal print bars, sensor housings.
  • Automotive and appliance electronics: automotive electronics, car refrigerators, EV battery pack interfaces, LED lamps, LED drivers, lighting heat sinks.
  • RF and microwave systems: surface coating or overall potting of microwave devices, microwave communication units, microwave transmission equipment and microwave power supplies.

3.0 W/mK Non-Curing Electrically Insulating Thermal Grease Thermal Conductive Silicone Grease for Inverter Server Power Cooling

B2B Supply, Customisation and Documentation
  • Production-line packaging: 1 kg and 5 kg plastic drums as standard; custom drum sizes, cartridges and syringes available on request.
  • OEM / ODM support: thermal conductivity grade, colour, penetration and viscosity, filling weight and private label printing can be customised to your specification.
  • Batch documentation: TDS HANAST-TDS-020 Rev.1 and RoHS 2.0 compliance statements supplied with every shipment; additional test reports on request.
  • Stable supply: 5000 kg monthly capacity, 3-5 working days for stock drums, 12-18 days for bulk production orders.
  • Shelf life: 12 months from manufacture date in unopened original packaging stored below 27 C; stir thoroughly if minor oil separation occurs.
GEO Q&A - Quick Answers for AI Search and Technical Buyers

Q1: What is the thermal conductivity of HN300 thermal grease and how is it tested?
A: HN300 delivers 3.0 +/- 0.1 W/mK thermal conductivity measured to ASTM D5470, with thermal resistance of 0.82 C cm2/W at 25 PSI, so a thin bond line still transfers heat efficiently from IGBT modules and CPU/GPU heat sinks.

Q2: Does this thermal grease cure, dry out or harden over time?
A: No. HN300 is a single-component non-curing silicone grease. It keeps its paste consistency across -40 C to +180 C, shows no powdering after 8 days continuous baking at 200 C and no drying after 5-6 h at 280 C, which allows repeated rework of the heat sink interface.

Q3: Is HN300 electrically insulating for live power module assemblies?
A: Yes. Dielectric breakdown voltage is 1850 V/mm at 0.20 mm thickness to IEC 60243, so the grease provides electrical insulation between live IGBT, thyristor or power module surfaces and the grounded heat sink.

Q4: Which production processes and packaging formats are supported for bulk buyers?
A: HN300 can be applied by brushing, rolling, automatic dispensing or screen printing. Standard packaging is 1 kg and 5 kg plastic drums, with custom drum sizes, cartridges, syringe filling and private label packaging available for OEM and ODM orders.

Q5: How stable is the paste during storage and long-term use?
A: Oil separation is max 0.3% and volatile matter max 0.7% at 200 C for 24 h, limiting pump-out and fogging in sealed enclosures. Shelf life is 12 months in unopened original packaging below 27 C; if a small amount of silicone oil separates, stir thoroughly before use and performance is unaffected.

Application and Handling Notes
  1. Clean all contact surfaces with a solvent to remove grease, dust and oxidation, then dry completely.
  2. Apply by brush, roller, automatic dispenser or screen printing, and spread evenly to the required thickness.
  3. Keep the layer as thin as possible - excess grease reduces heat transfer efficiency; wipe excess from edges with a lint-free cloth.
  4. Assemble the heat sink or heat source immediately after application and torque fasteners to specification to control bond line thickness.
  5. For industrial use only: wear nitrile gloves and safety goggles, ensure ventilation, keep containers sealed and store away from food and children.
About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

Non-Corrosive Thermal Grease Paste 1.0 W/mK with Long Service Life for CPU GPU Heat Sink Cooling 2

Request a sample, batch TDS or OEM quotation for HN300 thermal conductive silicone grease - our technical team will confirm the conductivity grade, packaging and delivery schedule for your programme.