Low Viscosity 1.0 W/mK Non-Curing Thermal Grease Thermal Conductive Grease for EMS Repair and Heat Sink Cooling

HN100 is a single-component, non-curing thermally conductive silicone grease with a soft, low viscosity paste (370 penetration) that spreads quickly by hand or by syringe dispenser - well suited to rework, refurbishment and high mix EMS assembly lines. It keeps its paste consistency from -50 C to +200 C, combines 2450 V/mm electrical insulation with 1.0 W/mK thermal conductivity, and offers near-zero free radical content with resistance to extreme temperature, water, ozone and weathering. The light 1.85 g/cm3 specific gravity keeps cartridges light and shipping cost low, and the compound is safe, non-toxic, odourless, non-corrosive and RoHS 2.0 compliant.

• Soft 370 +/- 20 penetration (1/10 mm): low viscosity paste that spreads evenly with a syringe, spatula or screen printer at low application force, ideal for repair benches and mixed-model lines.
• 1.0 +/- 0.1 W/mK thermal conductivity to ASTM D5470 - a cost efficient interface for mainstream consumer, appliance and power supply cooling.
• 2450 V/mm dielectric strength (IEC 60243, 0.20 mm) for electrical isolation between live devices and grounded heat sinks.
• Light specific gravity 1.85 +/- 0.08 g/cm3: lower weight per cartridge and lower freight cost per litre versus heavily filled pastes.
• Non-curing and serviceable: no hardening, no powdering after 8 days at 200 C, no drying after 3 h at 280 C, so heat sinks can be removed and refitted during rework.
• Low oil bleed and low volatility: oil separation max 0.3% and volatile matter max 0.6% at 200 C / 24 h to keep optics, connectors and sealed housings clean.

All values are measured under standard conditions and are for reference only. Actual thermal performance varies with application conditions, bond line thickness and contact pressure.

HN100 is applied between heat-generating components and heat dissipation parts (heat sinks, heat strips, housings) in electronic and electrical equipment, with a focus on rework, service and high mix assembly:

• Repair, rework and refurbishment: service kits and repair centres for laptops, desktop PCs, graphics cards, game consoles, set-top boxes, routers and projectors; heat sink re-seating after fan or board replacement.
• EMS and contract manufacturing: high mix low volume SMT lines, manual and semi-automatic dispensing stations, prototype and pilot builds, ODM programmes needing small pack sizes.
• Consumer electronics and computing: CPU and GPU heat sinks, notebook cooling modules, LED bulbs and drivers, power adapters and chargers, audio amplifiers, TV and monitor backlight boards.
• Power and industrial electronics: power transistors, thyristors, rectifier bridges, solid state relays, switching and regulated power supplies, power supply modules, inverters, motor controllers, UPS units.
• Appliance and instrumentation: appliance control boards, induction heating modules, instrument and sensor housings, thermistors, temperature sensors, printer heads and thermal print bars.
• Automotive and RF: automotive electronics, car refrigerators, EV accessory modules, plus surface coating or full encapsulation of microwave devices, microwave communication systems, microwave transmission equipment and microwave power supplies.

• Pack formats: 1 kg and 5 kg plastic drums as standard, with custom syringe, cartridge and tube filling for service kits and bench use on request.
• OEM / ODM: white or grey tone, penetration and viscosity adjustment, filling weight, printing and private label artwork can be tailored.
• Documentation: TDS HANAST-TDS-018 Rev.1 and RoHS 2.0 statement with each batch; additional test reports on request.
• Capacity and lead time: 8000 kg monthly capacity, 3-5 working days for stock drums, 12-18 days for bulk and custom filled orders.
• Shelf life: 12 months from manufacture date in unopened original packaging stored below 27 C; stir thoroughly if minor oil separation occurs.

1. Clean contact surfaces with a solvent to remove old grease, dust and oxidation, then dry completely.
2. Dispense a small amount by syringe or spatula and spread evenly to the required thickness.
3. Keep the layer as thin as possible - excess grease lowers heat transfer efficiency; wipe edges with a lint-free cloth.
4. Assemble the heat sink or heat source immediately and torque fasteners to specification to control bond line thickness.
5. Industrial use only: wear nitrile gloves and safety goggles, ensure ventilation, keep containers sealed and store away from food and children.

Request a sample, service kit pack or OEM quotation for HN100 low viscosity thermal conductive grease - our technical team will confirm grade, pack format and delivery schedule for your programme.