Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling
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Product Overview for silicone potting compound:
Your expert in thermal management. HN-8806 is specifically designed for heat dissipation, with a thermal conductivity of ≥0.76 W/m·K. It effectively reduces the operating temperature of power devices, enhancing reliability and lifespan. While maintaining high electrical insulation, it is the ideal choice for cooling power electronics.
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Key Features for silicone potting compound:
Efficient Thermal Conductivity (≥0.76 W/m·K) | High Insulation | Long-Term Thermal Stability | Low CTE | Non-Bleeding.
Technical Parameters:
Thermal Conductivity: ≥0.76 W/m·K
Coefficient of Thermal Expansion (CTE): 210 μm/(m·°C)
Volume Resistivity: 1.0×10¹⁶ Ω·cm
Operating Temperature Range: -50°C ~ +250°C
Hardness (Shore A): 45±5
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Product Applications for silicone potting compound:
Power Modules:Direct potting for IGBTs, MOSFETs, diodes, and other power devices.
LED Drivers:Thermal management and protection for high-power LED outdoor drive power supplies.
New Energy:Photovoltaic inverter power sections, energy storage system PCS units.
Industrial Drives:Inverter and servo drive power sections for heat dissipation and insulation.
Usage Instructions for silicone potting compound:
1. Preparation:Ensure heat-generating components and heat sink surfaces are clean for optimal thermal transfer.
2. Mixing & Deaeration:Mix thoroughly and vacuum degas, as air bubbles are poor thermal conductors.
3. Potting:Ensure the compound fully envelops the heat source and contacts the cooling surface.
4. Curing:Cure at room temperature or with heat as required.
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Important Notes for silicone potting compound:
Optimal thermal performance depends on bubble-free potting and good contact.
Packaging & Storage for silicone potting compound:
Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.
Store in a cool, dry place. Shelf life: 6 months.
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FAQ for silicone potting compound:
Q: What level is 0.76 W/m·K?
A: It is a medium-high level for potting compounds, suitable for most power electronics, effectively reducing hot-spot temperatures.
Q: Are thermal conductivity and electrical insulation contradictory?
A: No, this product is designed for electronics, balancing both thermal and electrical performance.
Q: How to achieve the best cooling effect?
A: Ensure full contact between the compound, heat source, and housing, with no air bubbles.
Q: Does it bleed silicone oil?
A: No, it cures into a stable elastomer with no risk of silicone oil separation.
Q: Do you have higher conductivity grades?
A: Yes, for requirements >1.5 W/m·K, please contact us for advanced grades.