Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling
Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling
Produktdetails:
Herkunftsort:
Guangdong, China
Markenname:
Hanast
Zertifizierung:
FDA/ROHS/REACH
Modellnummer:
HN-8806A/B
Einzelheiten
Herkunftsort:
Guangdong, China
Markenname:
Hanast
Zertifizierung:
FDA/ROHS/REACH
Modellnummer:
HN-8806A/B
Wärmeleitfähigkeit:
≥0,76 W/m·K
Wärmeausdehnungskoeffizient (CTE):
210 μm/(m·°C)
Volumenwiderstand:
1,0×10¹⁶ Ω·cm
Betriebstemperaturbereich:
-50°C ~ +250°C
Härte (Shore A):
45±5
Hervorheben:
High Light
Hervorheben:
thermally conductive silicone potting compound
,
silicone potting compound for power electronics
,
high thermal conductivity potting compound
Handelsinformationen
Min Bestellmenge:
1 kg
Preis:
Verhandlungsfähig
Verpackung Informationen:
50 kg/Satz, 25 kg/Stange
Lieferzeit:
5-7 Tage
Zahlungsbedingungen:
T/T, PayPal
Versorgungsmaterial-Fähigkeit:
100 Tonnen/Monat
Beschreibung des Produkts
Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling Product Overview for silicone potting compound: Your expert in thermal management. HN-8806 is specifically designed for heat dissipation, with a thermal conductivity of ≥0.76 W/m·K. It effectively reduces the operating temperature of power devices, enhancing reliability and lifespan. While maintaining high electrical insulation, it is the ideal choice for cooling power