Low Temperature Resistant Silicone Potting Compound For Cold Environment Electronics

Product Overview for Silicone Potting Compound:

HN-8808B Black Potting Compound is specially developed for electronic devices with high heat density. Boasting a thermal conductivity of 0.5 W/m·K, it efficiently dissipates heat from hot zones and reduces the operating temperature of core components. Its black fillers deliver certain EMI shielding performance, realizing integrated thermal management and EMC protection. This helps effectively prolong the service life of equipment.

Key Performance Parameters for Silicone Potting Compound:

Product Highlights for Silicone Potting Compound:

1. Efficient heat dissipation: High thermal conductivity cuts the temperature of power components such as MOSFETs and IGBTs by 10–30°C.

2. EMI shielding: Suppresses electromagnetic radiation effectively and improves overall EMC performance.

3. Reliable adhesion: Optimized for metal substrates including aluminum to avoid delamination during thermal cycling.

4. All-round environmental protection: Resists water, moisture, dust and chemical fumes, ideal for harsh working environments.

5. Superior flame resistance: The silicone rubber matrix delivers good flame retardancy for enhanced product safety.

Application Areas for Silicone Potting Compound:

1. High-power LED drivers & automotive HID ballasts

2. On-board chargers (OBC) and motor controllers for new energy vehicles

3. Industrial power supplies and servo drives

4. PV inverters & power modules for telecom base stations

Detailed Operating Guide for Silicone Potting Compound:

1. Surface Treatment: Fully clean aluminum housings and other heat sink bases to eliminate oxide layers and grease, so as to guarantee excellent thermal conductivity and adhesion.

2. Precise Proportioning: Use a scale with 0.1g precision and strictly follow the 10:1 weight mixing ratio.

3. Complete Blending: Stir the two components fully in a clean container for no less than 3 minutes. Scrape the container bottom to blend settled fillers evenly.

4. Vacuum Defoaming: Apply vacuum at -0.095 MPa to the mixed material for 3–5 minutes. This step is vital for deep potting to prevent air bubbles and resultant local overheating.

5. Potting & Curing: Pour the compound slowly into the device. Mild vibration helps remove residual air and achieve good leveling. Cure at 25°C. The product can be handled once surface cured; full thermal and mechanical properties develop after 7 days.

Packaging & Storage for Silicone Potting Compound:

Packaging: 22kg/set (20kg A + 2kg B), 11kg/set (10kg A + 1kg B)

Storage: Cool & dry place, avoid direct sunlight; Temp: 10–30°C

Shelf Life: 6 months (unopened, original package)