Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Electronic potting compound is a broad term used for bonding, sealing, potting, and coating protection of electronic components. Before curing, electronic potting compound is liquid and fluid; its viscosity varies depending on the material, performance, and manufacturing process of the product. It only realizes its value after complete curing, providing functions such as waterproofing, moisture resistance, dustproofing, insulation, thermal conductivity, sealing, corrosion resistance, temperature resistance, and shock absorption.

1. Low viscosity and strong penetrating power, capable of filling components and wire gaps.
2. Good performance and long pot life, suitable for high-volume automated production lines.
3. Liquid before curing, easy to pour and use.
4. Minimal sedimentation and stratification of filler and other powder components during potting and curing.
5. Flame retardant, weather resistant, thermally conductive, and resistant to alternating high and low temperatures.
6. When using silicone gel for potting, it does not release low molecular weight molecules, has no stress shrinkage, allows for deep vulcanization, and is non-corrosive.
7. The cured product has excellent electrical and mechanical properties, good heat resistance, good adhesion to various materials, and low water absorption and coefficient of linear expansion.
8. Transparent silicone becomes a transparent elastomer after vulcanization, making the components encapsulated within the silicone layer clearly visible. Component parameters can be measured individually by piercing the silicone layer, facilitating inspection and repair. Opaque gray or black silicone is also available, with different colors depending on the application.
9. Good adhesion and insulation effectively enhance the reliability of sensitive circuits and components, extending their service life.
10. Superior shock absorption, impact resistance, and insulation. It can operate stably in environments with large humidity and temperature differences, ranging from -50°C to +180°C.
11. During outdoor activities, it effectively protects circuits and electronic components from the adverse effects of ultraviolet light, ozone, moisture, and chemicals, maintaining stable equipment operation. When using potting compound, cut the tip of the tube and squeeze out the required amount.
12. Enhances the overall integrity of electronic components, improving resistance to external impacts and vibrations; improves insulation between internal components and circuits, facilitating miniaturization and weight reduction.
13. Cures at room temperature. Relative humidity and temperature in the air can alter the curing speed; higher temperatures result in faster curing, and lower temperatures in slower curing. Typically used are 100ml and 300ml plastic tubes, stored in a cool, dark place.

Electronic potting compounds cure at room temperature and are mainly used for potting room-temperature electronic components, automotive ignition coils, and circuit board protection. They are also used for potting heat-resistant electronic components and protecting circuit boards. They are suitable for potting and protecting high-power electronic components and modules with high heat dissipation and thermal conductivity requirements. They are also used for potting electronic component modules requiring transparency, particularly for room-temperature potting of digital tubes. Suitable for potting and circuit board protection of small and medium-sized electronic components requiring flame retardancy, such as capacitor encapsulation and solid-state relay potting.

• transformers
• high-voltage transformers
• rectifiers
• capacitors
• filters
• drivers
• igniters
• ignition coils
• power controllers
• aquarium pumps
• energy-saving modules
• LED lighting fixtures
• LED guardrail lights
• LED modules
• negative ion generators
• electronic door locks
• xenon lamps
• brighteners
• magnetic locks
• electronic induction modules

etc., serving the functions of potting, sealing, insulation, waterproofing, and moisture protection.

• The product to be potted must be kept dry and clean;
• Before use, check Agent A to see if there is any sedimentation, and stir Agent A thoroughly;
• Take the correct amount according to the mixing ratio, and weigh accurately. Remember that the ratio is by weight, not volume. Agents A and B must be thoroughly mixed to avoid incomplete curing;
• After mixing thoroughly, pour the adhesive promptly and use the mixed adhesive within its usable time;
• After pouring, the adhesive will gradually seep into the gaps in the product. If necessary, perform a second pouring;
• During the curing process, keep the environment clean to prevent impurities or dust from falling onto the uncured adhesive surface.
• This product will gradually solidify after mixing, its viscosity will gradually increase, and some heat will be released.
• The more adhesive mixed together, the faster the reaction and the faster the curing speed, which may be accompanied by the release of a large amount of heat. Please control the amount of adhesive mixed at one time, as the usable time is shortened due to the accelerated reaction. Use the mixed adhesive as soon as possible.
• Usable time: This refers to the time it takes for the viscosity of 100g of mixed adhesive to double at 25℃. It does not mean the adhesive cannot be used after this time.
• A very small number of people may experience mild skin allergies, mild itching, or pain after prolonged contact with the adhesive. It is recommended to wear protective gloves when using it. If it gets on the skin, wipe it off with acetone or alcohol and wash it thoroughly with a cleaning agent.
• Before using in large quantities, please test a small amount first to master the usage techniques and avoid errors. This is a non-hazardous material and can be transported as a general chemical.