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Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Q: Damage of components after potting (e.g., capacitor burst, chip failure)?

2025-10-14

Latest company case about Q: Damage of components after potting (e.g., capacitor burst, chip failure)?

Answer: Reasons: ① Excessive curing stress of adhesive (common in epoxy resin); ② High temperature during curing heat release; ③ Corrosiveness of the adhesive itself (acidic curing system); ④ Poor component sealing, allowing adhesive infiltration.