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High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

Szczegóły produktu:
Miejsce pochodzenia: Guangdong, Chiny
Nazwa handlowa: Hanast
Orzecznictwo: FDA/ROHS/REACH
Numer modelu: HN-8806A/B
Szczegółowe informacje
Miejsce pochodzenia:
Guangdong, Chiny
Nazwa handlowa:
Hanast
Orzecznictwo:
FDA/ROHS/REACH
Numer modelu:
HN-8806A/B
Przewodność cieplna:
≥0,76 W/m·K
Współczynnik rozszerzalności cieplnej (CTE):
210 μm/(m·°C)
Zakres temperatur pracy:
-50°C ~ +250°C
Twardość (Shore A):
45±5
Informacje handlowe
Minimalne zamówienie:
1 KG
Cena:
Negocjowalne
Szczegóły pakowania:
50 kg/zestaw, 25 kg/bar
Czas dostawy:
5-7 dni
Zasady płatności:
T/T, PayPal
Możliwość Supply:
100 ton/miesiąc
Opis produktu

High thermal conductivity silicone potting compound one to one ratio for new energy battery module encapsulation

 

 

 

Product Overview for silicone potting compound:

Your trusted thermal management solution. Custom-developed for heat dissipation, HN-8806 delivers thermal conductivity ≥0.76 W/m·K. It efficiently lowers operating temperatures of power components to boost equipment reliability and extend service life. Retaining outstanding electrical insulation performance, it serves as an optimal thermal interface material for power electronic encapsulation.

 

 

 

Product Applications for silicone potting compound:

Power Modules

Direct encapsulation for IGBT, MOSFET, diodes and other power semiconductor components

LED Drivers

Thermal conduction and all-round protection for high-power outdoor LED driver power supplies

New Energy Equipment

Power units of photovoltaic inverters and PCS modules for energy storage systems

Industrial Drives

Heat dissipation & electrical insulation for power parts of inverters and servo drivers

 

Usage Instructions for silicone potting compound:

1. Surface Preparation

Clean all heat-generating components and heat sink surfaces completely to maximize thermal conduction efficiency.

2. Mixing & Vacuum Degassing

Stir the two components evenly, then perform vacuum deaeration; trapped air bubbles severely weaken thermal conductivity.

3. Potting Operation

Pour the compound to fully cover heat-generating parts and achieve full contact with cooling substrates.

4. Curing Process

Cure the assembly under ambient temperature or elevated temperature per process requirements.

 

 

Important Notes for silicone potting compound:

Maximum thermal conductivity can only be achieved with bubble-free encapsulation and full intimate contact between the compound and components.

 

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

 

High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation 0

 

High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation 1