High thermal conductivity silicone potting compound one to one ratio for new energy battery module encapsulation
Product Overview for silicone potting compound:
Your trusted thermal management solution. Custom-developed for heat dissipation, HN-8806 delivers thermal conductivity ≥0.76 W/m·K. It efficiently lowers operating temperatures of power components to boost equipment reliability and extend service life. Retaining outstanding electrical insulation performance, it serves as an optimal thermal interface material for power electronic encapsulation.
Product Applications for silicone potting compound:
Power Modules
Direct encapsulation for IGBT, MOSFET, diodes and other power semiconductor components
LED Drivers
Thermal conduction and all-round protection for high-power outdoor LED driver power supplies
New Energy Equipment
Power units of photovoltaic inverters and PCS modules for energy storage systems
Industrial Drives
Heat dissipation & electrical insulation for power parts of inverters and servo drivers
Usage Instructions for silicone potting compound:
1. Surface Preparation
Clean all heat-generating components and heat sink surfaces completely to maximize thermal conduction efficiency.
2. Mixing & Vacuum Degassing
Stir the two components evenly, then perform vacuum deaeration; trapped air bubbles severely weaken thermal conductivity.
3. Potting Operation
Pour the compound to fully cover heat-generating parts and achieve full contact with cooling substrates.
4. Curing Process
Cure the assembly under ambient temperature or elevated temperature per process requirements.
Important Notes for silicone potting compound:
Maximum thermal conductivity can only be achieved with bubble-free encapsulation and full intimate contact between the compound and components.
Packaging & Storage for silicone potting compound:
Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.
Store in a cool, dry place. Shelf life: 6 months.
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