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High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

Name: High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8806A/B
Availability: InStock

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Hanast
Certification:	FDA/ROHS/REACH
Model Number:	HN-8806A/B

Detail Information

Place of Origin:

Guangdong, China

Brand Name:

Hanast

Certification:

FDA/ROHS/REACH

Model Number:

HN-8806A/B

Thermal Conductivity:

≥0.76 W/m·K

Coefficient Of Thermal Expansion (CTE):

210 μm/(m·°C)

Operating Temperature Range:

-50°C ~ +250°C

Hardness (Shore A):

45±5

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Encapsulation Silicone Potting Compound

High Thermal Conductivity Potting Compound

One To One Ratio Potting Compound

Trading Information

Minimum Order Quantity:

1KG

Price:

Negotiable

Packaging Details:

50KG/set, 25KG/bar

Delivery Time:

5-7days

Payment Terms:

T/T、paypal

Supply Ability:

100ton/month

Product Description

High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

Product Overview

Your trusted thermal management solution. Custom-developed for heat dissipation, HN-8806 delivers thermal conductivity ≥0.76 W/m*K. It efficiently lowers operating temperatures of power components to boost equipment reliability and extend service life. Retaining outstanding electrical insulation performance, it serves as an optimal thermal interface material for power electronic encapsulation.

Product Applications

Power Modules: Direct encapsulation for IGBT, MOSFET, diodes and other power semiconductor components
LED Drivers: Thermal conduction and all-round protection for high-power outdoor LED driver power supplies
New Energy Equipment: Power units of photovoltaic inverters and PCS modules for energy storage systems
Industrial Drives: Heat dissipation & electrical insulation for power parts of inverters and servo drivers

Usage Instructions

Surface Preparation: Clean all heat-generating components and heat sink surfaces completely to maximize thermal conduction efficiency.
Mixing & Vacuum Degassing: Stir the two components evenly, then perform vacuum deaeration; trapped air bubbles severely weaken thermal conductivity.
Potting Operation: Pour the compound to fully cover heat-generating parts and achieve full contact with cooling substrates.
Curing Process: Cure the assembly under ambient temperature or elevated temperature per process requirements.

Important Notes

Maximum thermal conductivity can only be achieved with bubble-free encapsulation and full intimate contact between the compound and components.

Packaging & Storage

Standard Packaging:	Component A 25kg/drum, Component B 25kg/drum
Storage Conditions:	Store in a cool, dry place
Shelf Life:	6 months

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High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

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