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Epoxy Potting Compound

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid

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Thermally Conductive Potting Compound

Degumming Agent

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Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.2
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Certification:

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Supply Ability:

1000000KG

Highlight:

Epoxy Potting Compound Resin

Conductive Epoxy Potting Compound

clear potting epoxy liquid

Product Description

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Product Overview
HN-5508 is an epoxy potting glue that cures at room temperature or low temperature. It has the characteristics of low viscosity, long operation time, good fluidity, and easy penetration into product gaps. After curing, there are no bubbles, the surface is smooth and glossy, the hardness is high, it has good acid and alkali resistance, moisture resistance and aging resistance, and has excellent insulation, pressure resistance and bonding strength. It is suitable for electronic or other products that require potting, sealing, packaging protection, insulation and moisture resistance.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 0

Product Features
Low viscosity: easy to penetrate into the gap of the product to ensure complete potting.

High hardness: the surface is smooth after curing, with high hardness, providing excellent mechanical protection.

Chemical resistance: acid and alkali resistance, moisture resistance, aging resistance, suitable for harsh environments.

Excellent electrical properties: high insulation, pressure resistance and bonding strength.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 1

Customers Good Feedback

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 2

Application areas
Electronic appliances: transformers, resistors, filters, temperature sensors, etc.

Industrial equipment: high voltage packaging, aquarium equipment, ultrasonic atomizers, etc.

Others: components that require insulation, flame retardancy and temperature resistance.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 3

Usage
Mix in a weight ratio of A:B = 5:1.

Operation time at 25℃ is 2-3 hours, surface curing in 6-8 hours, and full curing in 12-16 hours; or curing in 1.5-2 hours at 60-80℃.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 4

Packing specifications
30 KG/group (A component 25 KG/barrel, B component 5 KG/can)

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

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Products Details

Home > Products >

Epoxy Potting Compound

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid

All Category

Tin Cure Silicone Rubber

Platinum Cure Silicone Rubber

Clear Liquid Silicone

Food Safe Liquid Silicone

Electronic Silicone Gel

Squishy Silicone Gel

Silicone Potting Compound

Epoxy Potting Compound

Polyurethane Potting Compound

Thermally Conductive Potting Compound

Silicone Pigment

Degumming Agent

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.2
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Brand Name:

Hanast

Certification:

MSDS

Model Number:

HN-5508AB

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Minimum Order Quantity:

1KG

Price:

6.2

Packaging Details:

Plastic/Iron Drums

Delivery Time:

3-5 work days

Payment Terms:

T/T

Supply Ability:

1000000KG

Highlight:

Epoxy Potting Compound Resin

Conductive Epoxy Potting Compound

clear potting epoxy liquid

Product Description

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 0

Product Features
Low viscosity: easy to penetrate into the gap of the product to ensure complete potting.

High hardness: the surface is smooth after curing, with high hardness, providing excellent mechanical protection.

Chemical resistance: acid and alkali resistance, moisture resistance, aging resistance, suitable for harsh environments.

Excellent electrical properties: high insulation, pressure resistance and bonding strength.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 1

Customers Good Feedback

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 2

Application areas
Electronic appliances: transformers, resistors, filters, temperature sensors, etc.

Industrial equipment: high voltage packaging, aquarium equipment, ultrasonic atomizers, etc.

Others: components that require insulation, flame retardancy and temperature resistance.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 3

Usage
Mix in a weight ratio of A:B = 5:1.

Operation time at 25℃ is 2-3 hours, surface curing in 6-8 hours, and full curing in 12-16 hours; or curing in 1.5-2 hours at 60-80℃.

Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid 4

Packing specifications
30 KG/group (A component 25 KG/barrel, B component 5 KG/can)

Tags: