Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/m·K | Moisture Resistant
Product Overview for Thermally Conductive Potting Compound:
HN-8820 low-viscosity potting gel ensures deep penetration and complete encapsulation. With 2.0 W/m·K thermal conductivity, it protects components from heat and humidity.
Performance Highlights for Thermally Conductive Potting Compound
•Low viscosity for intricate geometries
•1:1 mix ratio
•Moisture and humidity resistance
•Fast heat-assisted curing
Technical Parameters for Thermally Conductive Potting Compound:
• Viscosity: 5000–8000 cP
•Density: 2.36 g/cm³
•Pot Life: 1–2 hrs
•Cure: 2–4 hrs @ 25°C
Applications for Thermally Conductive Potting Compound:
Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.
FAQ for Thermally Conductive Potting Compound:
Q: How low is the viscosity?
A: 5000–8000 cP – easy flow.
Q: Can it be used in humid environments?
A: Yes, it resists moisture.
Q: Is it suitable for fine-pitch components?
A: Yes, it flows into small gaps.
Q: Does it adhere to metals?
A: Yes, with proper surface prep.
Q: Can I get a sample?
A: Contact us for sample requests.
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