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HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation

Name: HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8806A/B
Availability: InStock

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Hanast
Certification:	FDA/ROHS/REACH
Model Number:	HN-8806A/B

Detail Information

Place of Origin:

Guangdong, China

Brand Name:

Hanast

Certification:

FDA/ROHS/REACH

Model Number:

HN-8806A/B

Name:

Silicone Potting Compound

Coefficient Of Thermal Expansion (CTE):

210 μm/(m·°C)

Volume Resistivity:

1.0×10¹⁶ Ω·cm

Operating Temperature Range:

-50°C ~ +250°C

Hardness (Shore A):

45±5

Thermal Conductivity:

0.8 W/m·K

Keywords:

Silicone Encapsulant

Feature:

Thermally Conductive ,waterproof ，Flame Retardant, High And Low Temperature Resistance

Application:

EV & Power Electronics Etc

Dielectric Intensity:

18~25 Kv/mm(25ºC)

Highlight:

High Light

Highlight:

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silicone potting compound with high thermal conductivity

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Trading Information

Minimum Order Quantity:

1KG

Price:

Negotiable

Packaging Details:

50KG/set, 25KG/bar

Delivery Time:

5-7days

Payment Terms:

T/T、paypal

Supply Ability:

100ton/month

Product Description

HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation

HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation 0

Product Overview for silicone potting compound:

Two-Part Addition-Cure Silicone Potting Rubber for Electronics.Featuring an ultra-low viscosity, it effortlessly fills deep sections and intricate gaps, providing robust encapsulation and long-term reliability for sensitive electronic components.

HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation 1

Key Features for silicone potting compound:

Dual-Cure Flexibility: Cures reliably at room temperature (RTV) or cures rapidly with heat acceleration.
Excellent Thermal Stability: Maintains optimal flexibility and performance across a wide temperature range from -50°C to 250°C.
Superior Protection: Delivers exceptional electrical insulation and high moisture resistance to safeguard electronics in harsh environments.
Deep-Section Curing: Low-viscosity formula ensures seamless flow and uniform curing in deep crevices and complex geometries.
Zero-Byproduct Cure: Zero heat emission (exothermic) and no harmful byproducts during cure, ensuring 100% non-corrosive sealing.
Dimensional Stability: Minimal shrinkage rate post-cure protects fragile internal components from mechanical stress.

HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation 2

Product Applications for silicone potting compound:

Tags:

HN-8806 Two-Component Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation

High Light

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