85 Shore D Epoxy Potting Glue Two-Component Epoxy Potting Sealant Glue Potting Epoxy For Electronics
Description of Epoxy Potting Compound
Epoxy potting compound is an adhesive widely used in fields such as electronic components, precision instruments, and electric motors. It possesses strong bonding capabilities, excellent electrical insulation properties, and corrosion resistance, enabling it to effectively protect the bonded objects while enhancing their stability and service life.
technical parameter of epoxy potting compound:
| efore curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30 |
Product Features of epoxy potting compound:
This product is an eco-friendly, flame-resistant epoxy resin potting AB glue. It has low viscosity, good fluidity, and easily penetrates into product gaps, providing excellent heat dissipation. It can cure at room temperature or moderate temperatures with a moderate curing speed. After curing, there are no bubbles, the surface is smooth and glossy, and it has high hardness. The cured material has good acid and alkali resistance, excellent moisture, water, and dust resistance, and is resistant to heat and atmospheric aging. The cured material also has good insulation, compressive strength, and high bonding strength. excellent heat dissipation. It can cure at room temperature or moderate temperatures with a moderate curing speed. After curing, there are no bubbles, the surface is smooth and glossy, and it has high hardness. The cured material has good acid and alkali resistance, excellent moisture, water, and dust resistance, and is resistant to heat and atmospheric aging. The cured material also has good insulation, compressive strength, and high bonding strength
Application of epoxy resin potting:
Widely used in electronic components such as: electronic transformers, negative ion generators, module power supplies, high-voltage packages, aquarium pumps, relays, capacitors, ignition coils, transformers, AC/DC modules, LEDs, LED modules, AC capacitors (vertical, horizontal, box-type, film-type) capacitors, lighting fixtures, electrical appliances, and various other electronic components for insulation filling and moisture-proof sealing
How to use epoxy potting compound:
● The products to be encapsulated must be kept dry and clean.
● Before use, please inspect Component A to check for any sedimentation; if present, stir Component A thoroughly until fully uniform.
● Measure out the required quantities according to the specified ratio, ensuring accurate weighing. Please remember that this is a ratio by weight, not by volume. After combining Components A and B, stir the mixture thoroughly to ensure uniformity and prevent incomplete curing.
● Once thoroughly mixed, proceed with the potting process immediately, and strive to utilize the entire batch of mixed resin within its designated pot life.
● After pouring, the resin will gradually penetrate into the crevices of the product; if necessary, perform a second pour.
● During the curing process, maintain a clean environment to prevent impurities or dust from settling onto the surface of the uncured resin.
Package of epoxy potting compound:
25kg/barrel
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