IP68 Waterproof Transparent Electronic Silicone Gel 1:1 Corrosion Resistant for LED Display Driver Encapsulation

IP68 Waterproof Transparent Electronic Silicone Gel for LED Display Driver Encapsulation

The HN-6607A/B is a two-component, addition-cure transparent electronic silicone gel with a convenient 1:1 mix ratio. Specially formulated for LED display driver encapsulation and outdoor electronic protection, it delivers exceptional optical clarity (≥90% light transmittance) combined with IP68-rated waterproof and dustproof sealing. After curing, the gel remains flexible and stress-absorbing, protecting sensitive electronic components from vibration, thermal shock, and environmental contamination.

Key Features

• IP68 Waterproof & Dustproof: Forms a seamless, void-free seal that withstands prolonged immersion and harsh outdoor conditions, ensuring long-term reliability for outdoor LED drivers, street lighting controls, and signage power supplies.
• Corrosion & Weather Resistance: Stable electrical and mechanical properties from -60°C to +200°C, resistant to rain, humidity, salt spray, and extreme climate deployment from deserts to Nordic winters.
• Superior Optical Clarity: ≥90% light transmittance enables visual inspection of encapsulated components without disassembly, ideal for LED display modules and optoelectronic devices.
• High Dielectric Strength: ≥18 kV/mm electrical insulation protects against short circuits and leakage currents in high-voltage LED driver circuits.
• 1:1 Convenient Mix Ratio: Simple 1:1 by weight mixing eliminates measurement errors, compatible with both manual dispensing and automated potting equipment.
• Low-Stress Flexible Cure: Shore A 15-25 hardness delivers excellent vibration dampening and thermal expansion absorption, preventing wire bond fatigue and solder joint failure.

Application Areas

• LED display driver modules, LED power supply units and LED control boards
• Outdoor lighting controllers, street lamp drivers and landscape lighting power modules
• Optical sensors, photodiode arrays and LED matrix displays
• Industrial sensor boards, IoT outdoor modules and security camera power boards

Processing Guidelines

• Mixing: Combine Part A and Part B at 1:1 weight ratio for 2-3 minutes until uniform. Vacuum degassing at -0.1 MPa for 3-5 minutes recommended for bubble-free results.
• Pot Life: Approximately 40-60 minutes at 25°C after mixing.
• Curing: Room temperature cure 4-6 hours at 25°C; accelerated cure 30-60 minutes at 60-80°C for production efficiency.

Packaging & Supply

Available in 20 kg drum kits and 200 kg drum kits with MSDS and TDS documentation. Custom packaging and private labeling available for OEM partners. Contact our technical team for custom formulations tailored to your LED driver encapsulation requirements.