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UL94 V0 Flame Retardant PCB Potting Silicone Gel 1:1 Two Component for LED Driver Encapsulation

UL94 V0 Flame Retardant PCB Potting Silicone Gel 1:1 Two Component for LED Driver Encapsulation

Product Details:
Place of Origin: Guangdong, China
Brand Name: HANAST
Certification: UL94 V0, ISO 9001:2015
Model Number: HN-6607FR
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
HANAST
Certification:
UL94 V0, ISO 9001:2015
Model Number:
HN-6607FR
Product Type:
Two Component Addition Cure Silicone Gel
Flame Retardant Rating:
UL94 V0
Mixing Ratio:
A:B = 1:1
Mixed Viscosity (25 C):
800-2000 Cps
Operate Time (25 C):
2 Hours
Curing Condition:
20-30 Mins At 120 C
Hardness (Shore A):
0-10
Penetration:
200-400 (1/10mm)
Operating Temperature:
-60 C To +200 C
Color:
Transparent
Highlight:

High Light

Highlight:

UL94 V0 Flame Retardant Potting

,

PCB Potting Compound Silicone Gel

,

LED Driver Encapsulation Silicone

Trading Information
Minimum Order Quantity:
25 KG
Packaging Details:
25kg plastic drum, 200kg iron drum, or customized packaging
Delivery Time:
3 working days for stock, 15-25 days for production
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
20000 KG per Month
Product Description

UL94 V0 Flame Retardant PCB Potting Silicone Gel

This UL94 V0 flame retardant PCB potting silicone gel is a premium two-component addition-cure liquid silicone designed for LED driver encapsulation, PCB board potting and battery protection circuits. It combines flame-retardant safety with superior electrical insulation, meeting the strictest requirements for electronic potting applications.

Key Features

  • UL94 V0 Flame Retardant — Self-extinguishing formula certified to UL94 V0, reducing fire risk in LED drivers, power modules and battery systems
  • Superior Electrical Insulation — High dielectric strength prevents short circuits and electrical leakage on PCB assemblies
  • 1:1 Easy Mix Ratio — Simple A:B = 1:1 mixing ensures consistent results with minimal operator training
  • Ultra-Soft Cured Elastomer — 0-10 Shore A hardness minimizes stress on delicate components and solder joints
  • Wide Temperature Range — Stable performance from -60°C to +200°C for demanding environments
  • Low Viscosity Flow — 800-2000 cps mixed viscosity penetrates tight gaps and complex geometries
  • Reworkable Formula — Low stress, easy to remove and rework without damaging PCB boards or components
  • High Transparency — Allows visual inspection of encapsulated components after curing
  • Waterproof & Corrosion Resistant — Moisture-proof, weather-resistant protection for outdoor and harsh environments

Typical Applications

  • PCB Board Potting — Flame-retardant, moisture-proof encapsulation for printed circuit boards
  • LED Driver Encapsulation — Protection for LED power supply and lighting driver modules
  • BMS Battery Management System — Insulation potting for battery protection circuits
  • Battery Cell Protection — Electrical isolation between cells in battery packs
  • Power Module & Electronic Component Sealing — General insulation and moisture-proof encapsulation

Technical Specifications

ParameterSpecification
Product TypeTwo Component Addition Cure Silicone Gel
Flame Retardant RatingUL94 V0
Mixing RatioA:B = 1:1
Mixed Viscosity (25°C)800-2000 cps
Operate Time (25°C)2 hours
Curing Condition20-30 mins at 120°C
Hardness (Shore A)0-10
Penetration200-400 (1/10mm)
Operating Temperature-60°C to +200°C
ColorTransparent

Contact us today for bulk pricing, technical datasheets, and free samples for testing.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

I
I*y
India Aug 6.2026
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.