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AB Two Component Electrical Insulation Potting Silicone Gel for PCB LED Driver BMS Battery Cell Protection 1:1 Mix

AB Two Component Electrical Insulation Potting Silicone Gel for PCB LED Driver BMS Battery Cell Protection 1:1 Mix

Product Details:
Place of Origin: Guangdong, China
Brand Name: WNRLN
Certification: ROHS
Model Number: HN-6607A/B
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
WNRLN
Certification:
ROHS
Model Number:
HN-6607A/B
Product Type:
Two Component Addition Cure Silicone Gel
Mixing Ratio:
A:B = 1:1
Mixed Viscosity:
800-2000 Cps (25℃)
Operate Time:
2 Hours (25℃)
Curing Condition:
20-30 Mins At 120℃
Hardness:
0-10 Shore A
Penetration:
200-400 (1/10mm)
Operating Temperature:
-60℃ To +200℃
Color:
Transparent
Application:
PCB, LED Driver, BMS, Battery Cell Protection
Highlight:

High Light

Highlight:

Electrical Insulation Potting Silicone Gel

,

PCB Component Encapsulation AB Gel

,

BMS Battery Protection Potting Material

Trading Information
Minimum Order Quantity:
20 Kilograms
Packaging Details:
20kg plastic drum with inner PE liner, export-grade pallet packaging
Delivery Time:
3-7 working days for stock, 15-20 days for production
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
50000 Kilograms per Month
Product Description

AB Two Component Electrical Insulation Potting Silicone Gel

This AB two component silicone gel is a premium addition-cure silicone rubber designed specifically for electrical insulation potting applications. It cures at both room and elevated temperatures, featuring excellent transparency, low viscosity, and extremely low crosslink density for superior penetration into tight spaces.

Key Features

  • Superior Electrical Insulation — Provides reliable dielectric protection for sensitive electronic components, preventing short circuits and electrical leakage
  • 1:1 Easy Mix Ratio — Simple A:B = 1:1 mixing ratio ensures consistent results with minimal operator training
  • Ultra-Soft Cured Elastomer — 0-10 Shore A hardness minimizes stress on delicate components and solder joints
  • Excellent Thermal Stability — Maintains performance across wide temperature range from -60°C to +200°C
  • Low Viscosity Flow — 800-2000 cps mixed viscosity penetrates tight gaps and complex geometries for complete encapsulation
  • Reworkable Formula — Low stress, easy to remove and rework without damaging PCB boards or components
  • High Transparency — Allows visual inspection of encapsulated components after curing

Typical Applications

  • PCB Board Potting — Moisture-proof, shock-resistant encapsulation for printed circuit boards
  • LED Driver Encapsulation — Protection for LED power supply modules against environmental factors
  • BMS (Battery Management System) — Insulation potting for battery protection circuits
  • Battery Cell Protection — Electrical isolation between individual cells in battery packs
  • Electronic Component Sealing — General insulation and moisture-proof encapsulation for sensors, connectors, and modules

Technical Specifications

Product TypeTwo Component Addition Cure Silicone Gel
Mixing RatioA:B = 1:1
Mixed Viscosity (25°C)800-2000 cps
Operate Time (25°C)2 hours
Curing Condition20-30 mins at 120°C
Hardness (Shore A)0-10
Penetration200-400 (1/10mm)
Operating Temperature-60°C to +200°C
ColorTransparent

Contact us today for bulk pricing, technical datasheets, and free samples for testing.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

I
I*y
India Aug 6.2026
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.