Flame Retardant Thermally Conductive Silicone Potting Compound 1:1 for Power Supply LED Module Encapsulation

Flame Retardant Thermally Conductive Silicone Potting Compound for Power Supply

HN-8806 is a two-component 1:1 addition-cure RTV silicone potting compound that cures at room temperature or with heating into a tough, flexible elastomer. It combines flame retardant self-extinguishing performance, thermal conductivity of 0.8 W/m·K and excellent electrical insulation, making it a reliable potting material for power supplies, LED modules, circuit boards and connectors that generate heat during operation.

Key Features

• Flame Retardant: Self-extinguishing grade; passes the UL-94 style 10-second burn test with no burning drip, improving fire safety of electronic assemblies.
• Thermally Conductive: 0.8 W/m·K thermal conductivity (≥0.76 W/m·K tested) helps dissipate heat from power components and LED drivers.
• Excellent Electrical Insulation: Dielectric strength 18-25 kV/mm and volume resistivity 1.0*10^16 Ω·cm protect high-voltage circuits.
• Wide Temperature Resistance: Stable from -50°C to 250°C for high-temperature power electronics and LED lighting.
• Low Shrinkage, No Corrosion: Flexible cured elastomer with low shrinkage rate that does not corrode electronic components.
• Easy 1:1 Mixing: Equal-weight two-component system with 4500-5000 mPa·s mixed viscosity for manual or automated metering potting lines.
• Waterproof Protection: Moisture absorption as low as 0.01-0.02%, sealing modules against humidity and water ingress.
• Customizable Color: Grey, white or black, with custom color options for brand and application requirements.

Typical Physical Properties

• Mix Ratio: A:B = 1:1 by weight
• Appearance: Grey and white fluid before curing
• Viscosity (25°C): 4500-5000 mPa·s (mixed)
• Density: 1.50 ± 0.05 g/cm³
• Operating Time (25°C): 18-24 minutes
• Curing Condition: 4-12 hours at 25°C (initial cure) or 12 minutes at 80°C
• Hardness: 50 ± 5 Shore A
• Thermal Conductivity: ≥0.76 W/m·K
• Dielectric Strength: 18-25 kV/mm
• Volume Resistivity: 1.0*10^16 Ω·cm
• Moisture Absorption: 0.01-0.02% (24 h, 25°C)
• Temperature Range: -50°C to 250°C
• Shelf Life: 6 months

Applications

• Power supply and switching power adapter potting
• LED driver and LED module encapsulation
• Circuit board and electronic connector protection
• High-temperature electronic component insulation

Packaging & Supply

Available in 25 kg/iron drum or A+B set packing with MSDS and TDS documentation. ODM and OEM services welcome. Contact our technical team for samples and specifications.