HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for high-temperature and harsh-environment electronics. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant with a 130-150°C heat distortion temperature. Supplied in bulk with factory-direct wholesale pricing, it delivers high dielectric strength, high compressive and bonding strength, and excellent acid/alkali, moisture and humid-heat ageing resistance for downhole, power and outdoor electronics.
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| Parameter | Value |
|---|---|
| Type | Two Component High Temperature Epoxy Potting Compound (high hardness / encapsulation grade) |
| Appearance before mixing | Component A: black or white viscous epoxy resin; Component B: reddish / transparent low-viscosity liquid |
| Density | A 1.4-1.5 g/cm3; B 1.05 g/cm3 |
| Mix ratio (by weight) | A : B = 5 : 1 |
| Pot life / working time | 2-3 h at 25°C (100 g mix) |
| Cure schedule | 25°C: 6-8 h tack-free, 12-16 h fully cured; or 60-80°C: 1.5-2 h |
| Hardness (cured) | Shore D 85-95 |
| Dielectric strength | 20-22 kV/mm |
| Volume resistivity | 1.1 x 1015 ohm.cm |
| Tensile strength | 16-18 kg/cm2 |
| Compressive strength | 18-22 kg/cm2 |
| Shrinkage | 0.35-0.55% |
| Water absorption | < 0.03% (25°C x 24 h) |
| Heat distortion temperature | 130-150°C |
| Low temperature resistance | -30°C |
| Compliance | RoHS compliant; non-dangerous goods; SDS available |
| Packaging | Component A 25 kg plastic barrel + Component B 5 kg plastic pot, 30 kg/set kit |
| Shelf life | 6 months in sealed containers at 25°C |
HN-5508 A/B is widely used for potting and protection of high-temperature and harsh-environment electronics: downhole and oil & gas electronics, power supply modules, EV battery packs and BMS boards, onboard chargers, LED drivers, 5G base station power units, solar inverter modules, wind turbine converters and hydrogen fuel cell components; transformers, resistors, filters, temperature sensors, temperature controllers, industrial sensors and motor stators; high-voltage ignition coils, high-voltage packages, automotive ECU modules, PCBs, aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It suits sealed, outdoor and wide-temperature electronics that require heat resistance, insulation and long-term reliability.
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Hanast is a direct potting compound manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory and high-volume production capacity. We supply HN-5508 A/B in bulk at factory-direct wholesale pricing, with free samples and fast lead times, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your downhole, power module or sensor design. Wholesale epoxy encapsulant supply is available across Asia and worldwide.
Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.
Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.
We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.
Q1: What is HN-5508 A/B and which applications does it suit?
A1: HN-5508 A/B is a 5:1 two-component high temperature black epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength. It is designed for encapsulating downhole electronics, power modules, transformers, sensors, EV battery packs and other harsh-environment electronics.
Q2: What is its high temperature performance and curing schedule?
A2: It withstands a 130-150°C heat distortion temperature with -30°C low-temperature performance. Mix A and B at 5:1 by weight; pot life is 2-3 hours at 25°C, tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C when curing time needs to be optimized.
Q3: Is it suitable for downhole and harsh environments?
A3: Yes. Its acid/alkali resistance, moisture proofing, humid-heat ageing resistance and good thermal cycling performance make it suitable for downhole, oil & gas and other wide-temperature, sealed electronics.
Q4: Can it be vacuum-degassed, and what is the insulation performance?
A4: Yes, it can be vacuum-degassed to remove air bubbles for void-free potting. It offers high dielectric strength of 20-22 kV/mm and volume resistivity of 1.1 x 1015 ohm.cm for reliable electrical insulation.
Q5: Do you supply in bulk, and what about samples, MOQ and wholesale pricing?
A5: Yes. We are a direct China manufacturer supplying HN-5508 A/B in bulk with factory-direct wholesale pricing. MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; free samples ship in 3-5 working days and wholesale/bulk orders in 7-15 days, with supply available across Asia and worldwide.