Transparent High Hardness 5:1 Epoxy Potting Compound Epoxy Encapsulant for 5G AAU RRU Data Center Rectifier Encapsulation

HN-5508AB is a two-component transparent epoxy potting compound with a 5:1 mix ratio by weight, formulated for high hardness encapsulation of telecom and data center power electronics. It cures to Shore D 80 with a heat distortion temperature of 130-150°C and 20-22 kV/mm dielectric strength, so 5G AAU/RRU modules, rectifier stages and power shelves stay dimensionally stable under clamp load, mast vibration and elevated operating temperatures. Water absorption below 0.03% keeps insulation resistance stable in humid outdoor cabinets, while the clear cured resin allows visual confirmation of complete, void-free filling.

• Shore D 80 high hardness, holds inserts, connectors and heavy components in position
• Transparent cured resin enables AOI and visual verification of void-free filling
• Heat distortion temperature 130-150°C for hot telecom cabinets and power shelves
• 20-22 kV/mm dielectric strength with electrical grade insulation
• Water absorption below 0.03% for humid, polluted outdoor environments
• 5:1 mix ratio by weight with stable 4500-6000 cps paste for controlled dispensing
• Excellent adhesion to PCB, aluminium heat sinks, ceramics and moulded plastics
• EU RoHS compliant, 6-month shelf life, solvent free

For potting, sealing, encapsulation protection and insulation of telecom and power electronics, including:

• 5G AAU modules
• 5G RRU remote radio units
• 5G small cells
• baseband units
• base station power supplies
• telecom rectifier modules
• power shelves
• data center power distribution units
• server power supplies
• UPS modules
• optical module housings
• PoE injectors
• fiber optic transceivers
• microwave and mmWave radio units
• outdoor telecom cabinets
• antenna control units
• heat sink mounted power boards
• LED drivers
• LED power supplies
• power supply modules
• AC capacitors
• miniature transformers
• ignition coils
• ultrasonic atomizers
• negative-ion generators
• electronic controllers
• sensors and transducers
• PCB assemblies
• smart meters
• EV on-board chargers
• BMS boards
• charging piles
• solar micro-inverters
• security camera modules
• industrial control boards

Typical values measured at 25°C / 60% RH; refer to the current TDS for the ordered grade.

1. Preheat Component A to 40-50°C so the 4500-6000 cps paste flows evenly; stir gently before weighing.
2. Weigh A and B at exactly 5:1 by weight, never by volume.
3. Mix slowly with a flat-bladed tool or planetary mixer, scraping the walls 2-3 times.
4. Vacuum degas the blend to remove air; the transparent resin makes residual bubbles visible.
5. Preheat the assembly and heat sink to 60-80°C for 1-2 hours to remove moisture before potting.
6. Dispense within the working time and cure undisturbed; do not stress inserts or connectors until the resin has gelled.

• Factory-direct supply from Guangdong, China, 50 tons per month capacity
• Transparent high hardness formulations for telecom and data center power modules
• TDS and MSDS for every grade, batch traceability and consistent optical clarity
• OEM / ODM: custom colour, hardness, viscosity, packing and private label
• Free samples, MOQ from 1 kg, export-grade leak-proof packaging

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

Q: What does high hardness mean for 5G AAU and RRU modules?
A: HN-5508AB cures to Shore D 80 with a heat distortion temperature of 130-150 degrees C, so the potted module resists deformation under clamp pressure, mast vibration and summer solar load, and it holds screw inserts and connectors firmly in place instead of creeping like a soft gel.

Q: Why is a transparent potting compound preferred for telecom power boards?
A: The clear cured resin keeps MOSFETs, transformers, shunt resistors and solder joints visible for AOI and field inspection, and it shows whether the cavity is completely filled and void free - an important process check before the module goes into an outdoor cabinet.

Q: How should HN-5508AB be mixed and dispensed?
A: Weigh Component A and B at 5:1 by weight, never by volume. Component A is a 4500-6000 cps paste and Component B is a 150-250 cps liquid, so preheat A to 40-50 degrees C for smooth flow, mix slowly, vacuum degas the blend, and dispense within the working time.

Q: Which electrical performance does the cured compound provide?
A: The cured compound offers 20-22 kV/mm dielectric strength and water absorption below 0.03% after 24 hours at 25 degrees C, providing insulation and moisture protection for rectifier, power shelf, UPS and remote radio units working in humid or polluted outdoor environments.

Q: What are the MOQ, packing and OEM options?
A: MOQ starts at 1 kg. Standard packing is a 30 kg set of 25 kg Component A plus 5 kg Component B, with 25 kg barrels and 200 kg drums available. OEM and private-label supply with custom colour, hardness and viscosity is produced factory direct in Guangdong, China; TDS, MSDS and free samples are available.