10:1 Mix Ratio Silicone Potting Compound with 0.2 W/m*K Thermal Conductivity and EMI Shielding for Automated Assembly Lines

HN-8808B Black Potting Compound is specially formulated for electronic equipment with high heat density. Boasting a thermal conductivity of 0.2 W/m·K, it efficiently dissipates heat from heat concentration zones and markedly reduces the operating temperature of core components. Its black filler system delivers moderate EMI shielding performance, realizing integrated thermal control and EMC compliance to prolong the service life of electronic devices.

• Efficient Heat Dissipation

  High thermal conductivity lowers the operating temperature of power devices such as MOSFETs and IGBTs by 10–30°C.

• EMI Suppression

  Suppresses electromagnetic radiation efficiently and elevates the EMC performance of finished products.

• Superior Substrate Adhesion

  Formulated with optimized adhesion to aluminum and other metal surfaces, resisting delamination during thermal cycling.

• All-Round Environmental Barrier

  Delivers waterproof, moisture-proof, dust-proof and chemical vapor resistance for reliable operation in harsh working environments.

• Reliable Flame Retardant Property

  Silicone matrix with outstanding flame resistance improves the safety of electronic assemblies.

• High-power LED drivers & automotive HID ballast modules
• New energy vehicle on-board chargers (OBC) and motor control units
• Industrial power supplies & servo drive units
• Photovoltaic inverters & power modules for telecom base stations

1. Surface Pre-Treatment

   Fully clean aluminum housings, heat sinks and other metal substrates to eliminate surface grease and oxidation films, securing ideal thermal conduction and bonding strength.

2. Precise Weighing Operation

   Deploy a weighing scale with 0.1g precision and strictly comply with the 10:1 weight mixing ratio.

3. Sufficient Homogenized Stirring

   Stir the two components fully for no less than 3 minutes inside a clean vessel. Continuously scrape the container bottom to blend precipitated fillers for consistent color and performance.

4. Mandatory Vacuum Defoaming

   Place mixed adhesive under -0.095 MPa vacuum for 3–5 minutes. This process is vital for deep potting to eliminate trapped bubbles that would trigger local overheating.

5. Potting & Curing Standards

   Pour the mixture slowly into assemblies; mild vibration helps exhaust residual air and smooth the surface. Complete curing proceeds at 25°C. Light handling is allowed after surface skinning, while full thermal and mechanical performance is reached after 7 full days.

1. Filler Sedimentation

   Fillers inside Part A will sink during storage. Thoroughly stir Component A before weighing. Neglecting this step results in uneven proportion and degraded thermal performance.

2. Forbidden Accelerated Heat Curing

   High-temperature curing is not allowed, as intense foaming will occur and damage the potting structure.

3. Thermally Conductive & Electrically Insulating

   This compound transfers heat only; it provides electrical insulation and cannot conduct electricity.

4. Enclosure Sealing Notice

   Minimal volatile substances are released during curing. Avoid fully hermetically sealing the housing for 3 days in summer and 7 days in winter.

• Standard Packaging: 22kg/set (20kg A + 2kg B)
• 11kg/set (10kg A + 1kg B)
• Storage Conditions: Store in a cool, dry place away from direct sunlight. Ideal storage temperature: 10-30°C
• Shelf Life: 12 months in original, unopened containers from date of manufacture