High Hardness Epoxy Encapsulation Resin Flexible Epoxy Potting Compound For Led Transformers/Coils Electronics
Product Description of epoxy potting compound:
Epoxy potting compound is a liquid or paste-like composite material made from epoxy resin as the base material, combined with a curing agent, fillers, and various modifying additives. Through a chemical reaction (curing), it forms a hard, dense, three-dimensional cross-linked network structure, completely encapsulating and sealing the electronic components, assemblies, or circuits that need protection within a solidified epoxy resin shell.
Feature of epoxy potting compound:
Electrical Insulation and Protection: Prevents short circuits and leakage, and resists environmental corrosion from dust, moisture, and salt spray.
Mechanical Support and Protection: Resists vibration, shock, and stress, securing internal components and preventing them from loosening or being damaged.
Thermal Management: For thermally conductive potting compounds with added thermal fillers, it helps dissipate heat from electronic components.
Chemical Corrosion Protection: Protects components from damage by acids, bases, solvents, and other chemicals.
Confidentiality and Tamper Protection: Once cured, it is difficult to remove without damage, protecting core circuit designs and intellectual property.
Product Application of epoxy potting compound::
Power modules (such as transformers, inductors, AC/DC modules)
Automotive electronics (ECU, sensors, ignition coils)
New energy (photovoltaic inverters, battery management systems (BMS), charging stations)
Underwater equipment, outdoor LED drivers
Precision sensors, aerospace electronic equipment
technical parameter of epoxy potting compound
| uring |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30 |
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