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Epoxy Potting Compound

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

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Thermally Conductive Potting Compound

Degumming Agent

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Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.1
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Certification:

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Supply Ability:

1000000KG

Highlight:

Sealing thermally conductive epoxy potting compound

thermally conductive epoxy potting compound liquid

Epoxy liquid clear silicone

Product Description

5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Product Overview
HN-5508 is an epoxy potting compound designed for the electronics and electrical industry. It has low viscosity, high insulation and temperature resistance, and is suitable for potting and protection of electronic components such as transformers, resistors, filters, etc.

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone 0

Core advantages
High insulation: volume resistivity 1.1×10¹⁵ Ω·cm, withstand voltage strength 20-22 kV/mm.

Temperature resistance: operating temperature range -30°C to 130-150°C, suitable for high temperature environment.

Fast curing: 12-16 hours at 25°C for full curing, or 1.5-2 hours at 60-80°C for curing.

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone 1

Application areas

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

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Products Details

Home > Products >

Epoxy Potting Compound

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

All Category

Tin Cure Silicone Rubber

Platinum Cure Silicone Rubber

Clear Liquid Silicone

Food Safe Liquid Silicone

Electronic Silicone Gel

Squishy Silicone Gel

Silicone Potting Compound

Epoxy Potting Compound

Polyurethane Potting Compound

Thermally Conductive Potting Compound

Silicone Pigment

Degumming Agent

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.1
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Brand Name:

Hanast

Certification:

MSDS

Model Number:

HN-5508AB

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Minimum Order Quantity:

1KG

Price:

6.1

Packaging Details:

Plastic/Iron Drums

Delivery Time:

3-5 work days

Payment Terms:

T/T

Supply Ability:

1000000KG

Highlight:

Sealing thermally conductive epoxy potting compound

thermally conductive epoxy potting compound liquid

Epoxy liquid clear silicone

Product Description

5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone 0

Core advantages
High insulation: volume resistivity 1.1×10¹⁵ Ω·cm, withstand voltage strength 20-22 kV/mm.

Temperature resistance: operating temperature range -30°C to 130-150°C, suitable for high temperature environment.

Fast curing: 12-16 hours at 25°C for full curing, or 1.5-2 hours at 60-80°C for curing.

Sealing Insulation Thermally Conductive Epoxy Potting Compound Liquid Clear Silicone 1

Application areas

Tags: