Product Description:

The Thermally Conductive Potting Compound is a high-quality product specially designed for various electronic applications requiring excellent thermal conductivity and electrical insulation properties. This advanced potting compound is ideal for use in electric control units, providing reliable protection and enhanced performance for electronic components.

With a volume resistivity of 5.0*10^14 Ω·cm (GB/T 31838.2-2019), this potting compound ensures efficient electrical insulation, making it suitable for a wide range of electronic devices. The low viscosity of 5000-8000 Mpa's allows for easy application and effective encapsulation of sensitive components, making it a preferred choice for applications requiring precise and intricate potting procedures.

The mix ratio of 1:1 simplifies the preparation process, ensuring consistent and reliable results with each use. This feature enhances the usability and convenience of the product, making it suitable for both professional and DIY electronic projects.

Designed as a thermal potting compound with low shrinkage, this product offers excellent thermal conductivity properties, effectively dissipating heat and maintaining optimal operating temperatures for electronic components. The encapsulation adhesive for power modules ensures robust protection against environmental factors and mechanical stress, extending the lifespan of electronic devices and enhancing their overall performance.

With a curing time of 2-4 hours at 25°C, this potting compound offers a balance between workability and efficiency, allowing for timely completion of projects without compromising on quality. The quick curing time accelerates the production process while ensuring a reliable and durable potting solution for electronic applications.

Overall, the Thermally Conductive Potting Compound is a versatile and high-performance product that meets the stringent requirements of modern electronic applications. Its exceptional thermal conductivity, electrical insulation properties, and low viscosity make it an ideal choice for electric control units and various other electronic devices that demand reliable and efficient potting solutions.

Features:

• Product Name: Thermally Conductive Potting Compound
• Product Number: Thermal Conductive Potting Compound
• Viscosity: 5000-8000 Mpa's (Low viscosity thermal potting adhesive)
• Shelf Life: 6 Months
• Shore Hardness: 45-55 ShoreA (Encapsulation adhesive for power modules)
• Curing time (25℃, h): 2-4H

Technical Parameters:

Applications:

Hanast HN-8820 Thermally Conductive Potting Compound is a high-quality product designed for various applications in the electronics industry. With its superior thermal conductivity and excellent insulation properties, this potting compound is ideal for use in electric control units where temperature management is crucial.

This silicone thermal potting adhesive is perfect for encapsulating electronic components that require efficient heat dissipation. The HN-8820 model from Hanast, originating from Dongguan China, is certified with ROHS, SDS, and Transportation Report, ensuring compliance with international standards for safety and environmental protection.

The product comes in a convenient packaging of 25KG/bar, with a minimum order quantity of 50KG. The supply ability of 100 tons per month guarantees a steady availability for your production needs. The curing time of 2-4 hours at 25℃ makes it efficient for quick manufacturing processes.

Hanast HN-8820 is a versatile solution for thermal management in electric control units, providing effective protection and stability to sensitive electronic components. The epoxy resin thermal encapsulation adhesive offers a reliable and durable coating that enhances the performance and longevity of your devices.

With a shelf life of 6 months, this thermal potting compound ensures long-term usability and effectiveness. The price is available upon interview, and payment terms accepted include T/T. Delivery time is quick, ranging from 5-7 days, allowing for efficient production planning.

In conclusion, Hanast HN-8820 Thermally Conductive Potting Compound is the perfect choice for applications requiring superior thermal management in electric control units. Its high-quality formulation and certification make it a reliable option for industries seeking silicone thermal potting adhesives for electronics. Invest in this epoxy resin thermal encapsulation adhesive for enhanced performance and protection of your electronic devices.

FAQ:

Q: What is the brand name of the Thermally Conductive Potting Compound?

A: The brand name is Hanast.

Q: What is the model number of the Thermally Conductive Potting Compound?

A: The model number is HN-8820.

Q: Where is the Thermally Conductive Potting Compound manufactured?

A: It is manufactured in Dongguan, China.

Q: What certifications does the Thermally Conductive Potting Compound have?

A: It is certified with ROHS, SDS, and Transportation Report.

Q: What is the minimum order quantity for the Thermally Conductive Potting Compound?

A: The minimum order quantity is 50KG.